NCP2823BFCT2G ON Semiconductor, NCP2823BFCT2G Datasheet - Page 3

• Manufacturer Part Number: NCP2823BFCT2G
• Description: IC FCI AUDIO AMP 9CSP
• Manufacturer: ON Semiconductor
• Type: Class Dr

Specifications of NCP2823BFCT2G

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 3W x 1 @ 4 Ohm
• Voltage - Supply: 2.5 V ~ 5.5 V
• Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 9-FlipChip
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
4. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.
7. The R
Human Body Model (HBM) ESD Rating are (Note 3)
Machine Model (MM) ESD Rating are (Note 3)
PIN FUNCTION DESCRIPTION
MAXIMUM RATINGS
Pin
AVDD, PVDD Pins: Power Supply Voltage (Note 2)
INP/N ,Pins: Input (Note 2)
Digital Input/Output: EN Pin:
WCSP 1.5 x 1.5 mm package (Notes 6 and 7)
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature (Note 6)
Storage Temperature Range
Moisture Sensitivity (Note 5)
C1
C3
C2
A1
B2
B1
A3
B3
A2
Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.
output current and external components selected.
qCA
VOUTN
VOUTP
PGND
AGND
PVDD
Name
AVDD
INN
INP
Pin
EN
Input Voltage
Input Current
Thermal Resistance Junction−to−Case
is dependent on the PCB heat dissipation. The maximum power dissipation (PD) is dependent on the min input voltage, the max
R
qCA
+
OUTPUT
OUTPUT
POWER
POWER
POWER
POWER
INPUT
INPUT
INPUT
Type
125 * T
P
D
A
Rating
Positive Differential Input
Negative Differential Input
Power Supply: This pin is the power supply of the device. A 4.7 mF ceramic capacitor or larger must
bypass this input to the ground. This capacitor should be placed as close a possible to this input.
Analog Power Supply: This pin must be connected to PVDD.
Positive output Special care must be observed at layout level. See the Layout recommendations.
Negative output: Special care must be observed at layout level. See the Layout recommendations.
Enable: When a High logic is applied to this pin, the device is activated
Power Ground: This pin is the power ground and carries the high switching current. A high quality
ground must be provided to avoid any noise spikes/uncontrolled operation. Care must be observed to
avoid high−density current flow in a limited PCB copper track.
Analog Ground: This pin is the analog ground of the device and must be connected to GND plane.
* R
qJC
http://onsemi.com
3
Description
ESD HBM
ESD MM
Symbol
V
T
R
T
MSL
V
JMAX
INP/N
I
V
T
T
STG
DG
qJC
DG
A
P
J
−0.3 to V
−0.3 to +V
−0.3 to +6.0
−40 to +125
−65 to +150
−40 to +85
Level 1
Value
2000
+150
200
A
90
1
= 25°C.
DD
DD
+0.3
°C/W
Unit
mA
°C
°C
°C
°C
V
V
V
V
V