NCP2823 ON Semiconductor, NCP2823 Datasheet
NCP2823
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NCP2823 Summary of contents
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... W from a 5.0 V supply in a Bridge Tied Load (BTL) configuration. Under the same conditions, NCP2823A can provide 1 8.0 W BTL load with less than 10% THD+N. For cellular handsets or PDAs it offers space and cost savings because no output filter is required when using inductive transducers ...
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R INN i Negative Differential Input R INP i Positive Differential Input INP AGND VOUTN AVDD PVDD PGND INN EN VOUTP (Top View) Figure 1. Pin Description BATTERY ...
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PIN FUNCTION DESCRIPTION Pin Name Pin Type A1 INP INPUT Positive Differential Input C1 INN INPUT Negative Differential Input B2 PVDD POWER Power Supply: This pin is the power supply of the device. A 4.7 mF ceramic capacitor or larger ...
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... V ENL ENR EN rising edge EN falling edge ENL NCP2823A 3 600 mW kHz NCP2823B 3 kHz F = 217 Hz, Input ac grounded kHz, Input ac grounded Pout = 600 mW (A. Weighted) P Input shorted together 217 Hz ...
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... A DD Conditions NCP2823A THD < 3 kHz 2 THD < NCP2823B THD < 3 kHz 2 THD < ...
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... 5 500 1000 Pout (mW) Figure 3. Efficiency Vs P 100 2 3.6 V 0.1 0.01 10 100 Pout (mW) Figure 5. NCP2823B, THD+N vs Pout 0 2.5 V 0.01 3.6 V 0.001 10 100 1000 FREQUENCY (Hz) Figure 7. THD+N vs Frequency 100 P out 10 1 0.1 0.01 1500 2000 10 Figure 4 ...
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TYPICAL OPERATING CHARACTERISTICS 0.1 0.01 0.001 10 100 1000 FREQUENCY (Hz) Figure 9. THD+N vs Frequency 0 2.5 V 0.01 4.2 V ...
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TYPICAL OPERATING CHARACTERISTICS 0 −20 − rip pp −60 − 200 mV rip −100 −120 10 100 1000 FREQUENCY (Hz) Figure 15. CMRR vs Frequency −10 −20 −30 −40 −50 V ...
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... H−Bridge. When the current is higher than 2A for the NCP2823B or 1A for the NCP2823A, the H−Bridge is positioned in high impedance. When the short circuit is removed or the current is lower, the NCP2823 goes back to normal operation. This protection avoids over current due to a bad assembly (Output shorted together ground) ...
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... Tape and Reel Packaging Specifications Brochure, BRD8011/D. Demo Board Available: NCP2823AGEVB/D and NCP2823BGEVB/D evaluation board configure the device in typical application. Package WCSP − 9 − 1.45 x 1.45 mm (Pb−Free) WCSP − ...
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... CROWNS OF SOLDER BALLS. MILLIMETERS DIM MIN MAX A 0.540 0.660 A1 0.210 0.270 A2 0.330 0.390 D 1.450 BSC E 1.450 BSC b 0.290 0.340 e 0.500 BSC D1 1.000 BSC E1 1.000 BSC ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP2823/D ...