MCIMX27MOP4A Freescale Semiconductor, MCIMX27MOP4A Datasheet - Page 110

• Manufacturer Part Number: MCIMX27MOP4A
• Description: IC MPU I.MX27 19X19 473MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX27r

Specifications of MCIMX27MOP4A

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, LCD, POR, PWM, WDT
• Program Memory Type: ROMless
• Ram Size: 45K x 8
• Voltage - Supply (vcc/vdd): 1.38 V ~ 1.52 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 473-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Package Information and Pinout
5.2
Table 59 on page 111
Table 60 on page 116
list is sorted alphabetically by the name of the contact. The connections of these pins depend solely upon
the user application, however there are a few factory test signals that are not used in a normal application.
Following is a list of these signals and how they are to be terminated for proper operation of the
i.MX27/MX27L processor:
110
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•
•
•
•
CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
EXT_60M: To ensure proper operation, connect this signal to ground.
EXT_266M: To ensure proper operation, connect this signal to ground.
Most of the signals shown in
of the signals at a particular pad are shown in the form of a compound signal name. Please refer to
Table 3
Pin Assignments (17 mm × 17 mm)
for complete information on the signal multiplexing schemes of these signals.
shows the i.MX27 full 17 × 17 mm package MAPBGA pin assignments.
identifies the pin assignments for the ball grid array (BGA) for full package. The
i.MX27 and i.MX27L Data Sheet, Rev. 1.6
Table 59
are multiplexed with other signals. For ease of reference, all
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