XC3S200AN-4FT256I Xilinx Inc, XC3S200AN-4FT256I Datasheet - Page 74

• Manufacturer Part Number: XC3S200AN-4FT256I
• Description: IC FPGA SPARTAN 3AN 256FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S200AN-4FT256I

• Number Of Logic Elements/cells: 4032
• Number Of Labs/clbs: 448
• Total Ram Bits: 294912
• Number Of I /o: 195
• Number Of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Mechanical Drawings
Detailed mechanical drawings for each package type are available from the Xilinx website at the specified location in
Table
Material Declaration Data Sheets (MDDS) are also available on the
Table 66: Xilinx Package Documentation
Package Thermal Characteristics
The power dissipated by an FPGA application has implications on package selection and system design. The power
consumed by a Spartan-3AN FPGA is reported using either the
integrated in the Xilinx® ISE® development software.
Spartan-3AN FPGA packages. This information is also available using the Thermal Query tool at
http://www.xilinx.com/cgi-bin/thermal/thermal.pl.
The junction-to-case thermal resistance (
body (case) and the junction temperature per watt of power consumption. The junction-to-board (
the difference between the board and junction temperature. The junction-to-ambient (
difference between the ambient environment and the junction temperature. The 
velocities, measured in linear feet per minute (LFM). The “Still Air (0 LFM)” column shows the 
a fan. The thermal resistance drops with increasing air flow.
Table 67: Spartan-3AN FPGA Package Thermal Characteristics
DS557 (v4.1) April 1, 2011
Product Specification
Notes:
1.
2.
TQ144
TQG144
FT256
FTG256
FG400
FGG400
FG484
FGG484
FG676
FGG676
XC3S50AN
XC3S200AN
XC3S400AN
XC3S700AN
XC3S1400AN
Device
Thermal characteristics are similar for leaded (non-Pb-free) packages.
Use the Thermal Query tool at
Package
66.
Package
TQG144
FGG400
FGG484
FGG484
FGG676
FTG256
FTG256
FTG256
Package Drawing
Package Drawing
Package Drawing
Package Drawing
Package Drawing
(1)
Drawing
Junction-to-Case
http://www.xilinx.com/cgi-bin/thermal/thermal.pl
(
13.4
7.4
6.2
5.3
4.3
JC
PK169_TQ144
PK461_TQG144
PK158_FT256
PK424_FTG256
PK182_FG400
PK108_FGG400
PK183_FG484
PK110_FGG484
PK155_FG676
PK394_FGG676
)
JC
) indicates the difference between the temperature measured on the package
MDDS
Junction-to-Board
Table 67
www.xilinx.com
(
32.8
23.3
12.9
11.5
10.9
JB
)
provides the thermal characteristics for the various
XPower Power Estimator
Xilinx website
(0 LFM)
Still Air
38.9
29.0
22.5
19.4
17.7
Spartan-3AN FPGA Family: Pinout Descriptions
for specific device information.
Junction-to-Ambient (
at Different Air Flows
250 LFM
JA
for each package.
32.8
23.8
16.7
15.0
13.7
value is reported at different air
JA
or the
) value reports the temperature
500 LFM
32.5
15.6
12.6
23.0
13.9
JA
XPower Analyzer
JB
value in a system without
) value similarly reports
JA
)
750 LFM
31.7
22.3
15.0
13.4
12.1
calculator
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Units
74