BAS16J,135 NXP Semiconductors, BAS16J,135 Datasheet - Page 17

• Manufacturer Part Number: BAS16J,135
• Description: DIODE SW 100V 215MA HS SOD323
• Manufacturer: NXP Semiconductors

Specifications of BAS16J,135

• Package / Case: SC-90, SOD-323F
• Mounting Type: Surface Mount
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Current - Average Rectified (io): 250mA (DC)
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 500 mA
• Max Surge Current: 4 A
• Maximum Power Dissipation: 550 mW
• Maximum Diode Capacitance: 1.5 pF
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76)
Fig 30. Reflow soldering footprint BAS516 (SOD523/SC-79)
2.75
1.2
(2 )
Reflow soldering is the only recommended soldering method.
1.2
(2 )
(2 )
0.7
0.8
1.5 (2 )
Rev. 05 — 25 August 2008
2.15
1.1
2.9
5
(2 )
0.5
(2 )
0.6
High-speed switching diodes
BAS16 series
Dimensions in mm
direction during soldering
Dimensions in mm
preferred transport
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
occupied area
sod523_fr
sod323_fw
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