DTP-BGA OKI METCAL, DTP-BGA Datasheet - Page 6

• Manufacturer Part Number: DTP-BGA
• Description: KIT DIP TRANSFER BGA 3-PLATES
• Manufacturer: OKI METCAL

Specifications of DTP-BGA

• Accessory Type: DIP Transfer Plates
• For Use With/related Products: -
• Other names: DTPBGA

APR-5000 Array Package Rework System
Design and functionality come together in the compact and powerful APR-5000 Array Package Rework System.
This system provides closed-loop control, optimized vision and precise component placement on a compact
platform of 19" x 30" (483mm x 762mm).
Capable of handling boards up to 9" x 15" (229mm x 381mm), with a placement accuracy to 0.001" (0.025mm)
and interconnection pitches as low as 0.012" (0.3mm), the APR-5000 is ideal for reworking smaller assemblies
such as cell phones and laptop computers.
In addition, the APR-5000 Array Package Rework System uses standard line voltages and self
contained pumps rather than special wiring and shop air. This allows the system to be set up
and moved to any bench, without having to be fitted/plumbed in by an engineer. The
system also offers N2 as a standard software option, however, a nitrogen supply is
required.
The system also incorporates OK International's exclusive integral vision system that
makes viewing, aligning and accurately placing a component easy by allowing
operators to simultaneously view the topside of the PCB and a superimposed image
of the underside of the component. Then, with micrometer adjustment, images can be
accurately aligned in the X, Y & Theta axes prior to placement. In addition, integrating the
vision system with the machine's software eliminates the need for multiple monitors.
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