DTP-BGA OKI METCAL, DTP-BGA Datasheet - Page 5

• Manufacturer Part Number: DTP-BGA
• Description: KIT DIP TRANSFER BGA 3-PLATES
• Manufacturer: OKI METCAL

Specifications of DTP-BGA

• Accessory Type: DIP Transfer Plates
• For Use With/related Products: -
• Other names: DTPBGA

To help guarantee uniformity and higher process yields, the APR-5000 Series employs a single reflow/placement head that
moves to the correct position for rework, allowing the PCB to remain stationary during the process. Plus, the PCB is
centralized relative to the pre-heaters to provide superior uniformity of heating during rework.
The enhanced software is instructive and intuitive, walking the engineer through the steps of process development and then
instructing the operator to ensure consistent, repeatable execution of the automatic profile functions
Lead-Free Compatible
As the implementation of lead-free assemblies intensifies, the APR-5000 Array Package Rework Systems have the power,
size and sophistication to meet the required higher, cost-sensitive performance criteria.
The innovative OK International single
reflow/placement head design helps
achieve a consistently small Delta T
across the board and the component.
Thermal damage is precluded due to
the system's precisely controlled pre-
heaters; lead-free profiles can be
quickly developed via the system's
five thermocouples; and closed-loop,
computer controls and intuitive
software help operators maintain the
ideal process from start to finish.
The APR-5000 Array Package
Rework Systems provide full
convection in both reflow heater and
pre-heaters to provide fast ramp and
precise peak reflow temperature
without thermal damage to sensitive
components unsuitable for heating
above 240°C. And with four heating
zones and one cooling zone, the
precise profiles needed for successful
soldering/desoldering of lead-free
packages are easily delivered.
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