MP3V5010GP Freescale Semiconductor, MP3V5010GP Datasheet - Page 6

• Manufacturer Part Number: MP3V5010GP
• Description: IC PRESSURE SENSOR 8-SOP
• Manufacturer: Freescale Semiconductor
• Type: Gager

Specifications of MP3V5010GP

• Pressure Type: Gauge
• Operating Pressure: 1.45 PSI
• Port Size: Male, 0.12" (3mm) OD
• Output: 0.1 ~ 3.1 V
• Voltage - Supply: 2.7 V ~ 3.3 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOP Side Port
• Output Voltage Range: 0.1 to 3.1V
• Pressure Range: 0 to 10KPa
• Overload Pressure (max): 75KPa
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package Type: Case 1369-01
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.3V
• Accuracy: 5 %
• Output Type: Analog
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 2.7 VDC
• Supply Voltage (max): 3.3 VDC
• Supply Current: 7 mA
• Operating Pressure Range: 0 To 10kPa
• Connection Size: 0.125"
• Sensitivity, V/p: 270mV/kPa
• Sensor Case Style: SOP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MP3V5010
6
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
MP3V5010GC6U/C6T1
MP3V5010GP
MP3V5010DP
MP3V5010GVP
Freescale designates the two sides of the pressure sensor
Surface mount board layout is a critical portion of the total
Pressure
Pressure
Pressure Error Band
Error
(kPa)
–0.1
–0.2
–0.3
–0.4
–0.5
0.5
0.4
0.3
0.2
0.1
0
Part Number
0
0.060 TYP 8X
1.52
Figure 5. Small Outline Package Footprint
0.100 TYP 8X
2.54
Case Type
0.660
16.76
482A
1369
1351
1368
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
following table:
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
The Pressure (P1) side may be identified by using the
inch
mm
Side with Port Attached
Side with Part Marking
Side with Part Marking
Side with Port Attached
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
0 to 10 (kPa)
Pressure
10
Side Identifier
Pressure (P1)
Freescale Semiconductor
Pressure (kPa)
Error (Max)
±0.5 (kPa)
Sensors