MP3V5010GP Freescale Semiconductor, MP3V5010GP Datasheet - Page 4

• Manufacturer Part Number: MP3V5010GP
• Description: IC PRESSURE SENSOR 8-SOP
• Manufacturer: Freescale Semiconductor
• Type: Gager

Specifications of MP3V5010GP

• Pressure Type: Gauge
• Operating Pressure: 1.45 PSI
• Port Size: Male, 0.12" (3mm) OD
• Output: 0.1 ~ 3.1 V
• Voltage - Supply: 2.7 V ~ 3.3 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOP Side Port
• Output Voltage Range: 0.1 to 3.1V
• Pressure Range: 0 to 10KPa
• Overload Pressure (max): 75KPa
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Package Type: Case 1369-01
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.3V
• Accuracy: 5 %
• Output Type: Analog
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 2.7 VDC
• Supply Voltage (max): 3.3 VDC
• Supply Current: 7 mA
• Operating Pressure Range: 0 To 10kPa
• Connection Size: 0.125"
• Sensitivity, V/p: 270mV/kPa
• Sensor Case Style: SOP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MP3V5010
4
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
The performance over temperature is achieved by
Figure 2
The MP3V5010 series pressure sensor operating
Pressure
illustrates the Differential or Gauge configuration
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
Frame
Lead
Wire Bond
1.0 μF
Differential Sensing
Fluoro Silicone
Gel Die Coat
Figure 2. Cross-Sectional Diagram SOP
Element
0.01 μF
(not to scale)
V
s
+3 V
P1
P2
GND
IPS
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in
output will saturate outside of the specified pressure range.
Die
V
out
Figure 3
Figure 4
shows the recommended decoupling circuit for
shows the sensor output signal relative to
470 pF
Steel Cap
Stainless
OUTPUT
Die Bond
Thermoplastic
Case
Freescale Semiconductor
Figure
Sensors
3. The