MP3V5004DP Freescale Semiconductor, MP3V5004DP Datasheet - Page 5

• Manufacturer Part Number: MP3V5004DP
• Description: IC PRESSURE SENSOR 8-SOP
• Manufacturer: Freescale Semiconductor
• Type: Differentialr

Specifications of MP3V5004DP

• Pressure Type: Differential
• Operating Pressure: 0.57 PSI, 3.92 kPa
• Port Size: Male, 0.13" (3.302mm) Tube, Dual
• Output: 0.6 ~ 3 V
• Voltage - Supply: 2.7 V ~ 3.3 V
• Termination Style: PCB
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 8-SOP Dual Port
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Package Type: SNSR
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.3V
• Accuracy: 1.5 %, 2.5 %
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Operating Supply Voltage: 3 V
• Supply Voltage (min): 2.7 V
• Supply Voltage (max): 3.3 V
• Supply Current: 10 mA
• Output Voltage: 0.6 V to 3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
Freescale Semiconductor designates the two sides of the
Surface mount board layout is a critical portion of the total
MP3V5004GC6U/T1
MP3V5004GP
MP3V5004DP
MP3V5004GVP
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES
Part Number
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.060 TYP 8X
1.52
Figure 5. SOP Footprint
0.100 TYP 8X
Case Type
2.54
482A
0.660
16.76
1369
1351
1368
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
table below.
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
The Pressure (P1) side may be identified by using the
inch
mm
Side with Port Attached
Side with Port Attached
Side with Part Marking
Stainless Steel Cap
Pressure (P1) Side Identifier
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
Pressure
MP3V5004G
5