MS5534-CM Measurement Specialties Inc., MS5534-CM Datasheet - Page 19

• Manufacturer Part Number: MS5534-CM
• Description: SENSOR BAROMETRIC 1.1BAR 16BIT
• Manufacturer: Measurement Specialties Inc.

Specifications of MS5534-CM

• Pressure Type: Absolute
• Operating Pressure: 0.15 ~ 16 PSI, 10 ~ 1100 mbar
• Output: Digital
• Voltage - Supply: 2.2 V ~ 3.6 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 9 x 9mm Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 223-1100-2

ASSEMBLY
MECHANICAL STRESS
It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the
PCB should not be below 1.6 mm. A thicker PCB is stiffer creating less stress on the soldering contacts. For
applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin
PCB’s in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401) at the
corners of the sensor as shown below.
MOUNTING
The MS5534C can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.
Special care has to be taken to not touch the protective gel of the sensor during the assembly.
The MS5534C can be mounted with the cap down or the cap looking upwards. In both cases it is important to
solder all contact pads. The Pins PEN and PV shall be left open or connected to VDD. Do not connect the Pins
PEN and PV to GND!
SEALING WITH O-RING
In products like outdoor watches the electronics must be protected against direct water or humidity. For those
products the MS5534CM provides the possibility to seal with an O-ring. The protective cap of the MS5534CM is
made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5534CM is filled
with silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer
diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical
direction.
DA5534C_003.doc
0005534C1175 ECN1118
Solder at both sides to
increase mechanical
stability
Placement cap down
(hole in PCB to fit cap)
June 16th, 2008
Fixing with Globtop
increases mechanical
stability
Placement cap up
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