MPXV4006GP Freescale Semiconductor, MPXV4006GP Datasheet - Page 6

SENSOR GAUGE PRESS .87PSI MAX

MPXV4006GP

Manufacturer Part Number
MPXV4006GP
Description
SENSOR GAUGE PRESS .87PSI MAX
Manufacturer
Freescale Semiconductor
Series
MPXV4006r
Datasheets

Specifications of MPXV4006GP

Pressure Type
Gauge
Operating Pressure
0.87 PSI
Output
0 ~ 4.7V
Voltage - Supply
4.75 V ~ 5.25 V
Termination Style
PCB
Operating Temperature
-10°C ~ 60°C
Package / Case
8-SOP Side Port
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 60 C
Minimum Operating Temperature
- 10 C
Operating Supply Voltage
5 V
Supply Current
10 mA
Output Voltage
0.2 V to 4.8 V
Operating Pressure Range
0 To 6kPa
Connection Size
3.175mm
Sensitivity, V/p
766mV/kPa
Sensor Case Style
SOP
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MPXV4006
6
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
isolates the die from the environment. The pressure sensor is
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
MPVZ4006GW6U
MPVZ4006GW7U
MPVZ4006G6U/T1
MPVZ4006G7U
MPXV4006GC6U/T1
MPXV4006GC7U
MPXV4006GP
MPXV4006DP
Freescale designates the two sides of the pressure sensor
Surface mount board layout is a critical portion of the total
Pressure
Part Number
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.060 TYP 8X
1.52
Figure 6. SOP Footprint (Case 482)
Case Type
482C-03
1735-01
1560-02
482B-03
1369-01
1351-01
482-01
482A
0.100 TYP 8X
2.54
0.660
16.76
designed to operate with positive differential pressure
applied, P1 > P2.
table below:
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
The Pressure (P1) side may be identified by using the
inch
mm
Vertical Port Attached
Vertical Port Attached
Stainless Steel Cap
Stainless Steel Cap
Vertical Port Attached
Vertical Port Attached
Side with Port Attached
Side with Part Marking
0.100 TYP
2.54
Pressure (P1) Side Identifier
0.300
7.62
Freescale Semiconductor
Sensors

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