MPXV4006GP Freescale Semiconductor, MPXV4006GP Datasheet - Page 5

• Manufacturer Part Number: MPXV4006GP
• Description: SENSOR GAUGE PRESS .87PSI MAX
• Manufacturer: Freescale Semiconductor
• Series: MPXV4006r

Specifications of MPXV4006GP

• Pressure Type: Gauge
• Operating Pressure: 0.87 PSI
• Output: 0 ~ 4.7V
• Voltage - Supply: 4.75 V ~ 5.25 V
• Termination Style: PCB
• Operating Temperature: -10°C ~ 60°C
• Package / Case: 8-SOP Side Port
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 60 C
• Minimum Operating Temperature: - 10 C
• Operating Supply Voltage: 5 V
• Supply Current: 10 mA
• Output Voltage: 0.2 V to 4.8 V
• Operating Pressure Range: 0 To 6kPa
• Connection Size: 3.175mm
• Sensitivity, V/p: 766mV/kPa
• Sensor Case Style: SOP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
On-Chip Temperature Compensation and Calibration
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
characteristics are based on use of dry air as pressure media.
Media, other than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
Lead
Frame
Wire
Bond
The performance over temperature is achieved by
Figure 2
The MPXV4006/MPVZ4006 series sensor operating
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Differential Sensing
Figure 4. Output versus Pressure Differential
0
at ±5.0% V
Transfer Function (kPa):
V
V
TEMP = 10 to 60°C
Figure 2. Cross Sectional Diagram SOP
out
S
Element
= 5.0 Vdc
Fluorosilicone
illustrates the Differential or Gauge configuration
= V
Gel Die Coat
S
MAX
*[(0.1533*P) + 0.053] ± 5.0% V
Operating Characteristics)
FSS
(without auto zero, Note 5 in
(not to scale)
2.0
Differential Pressure (kPa)
P2
P1
MIN
Die
FSS
4.0
TYPICAL
Die Bond
Thermoplastic
Case
Steel Cap
Stainless
6.0
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
relative to pressure input. Typical, minimum and maximum
output curves are shown for operation over a temperature
range of 10°C to 60°C using the decoupling circuit shown in
Figure
pressure range.
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
1.0 μF
0
Figure 3
Figure 4
Figure 3. Recommended Power Supply Decoupling
0
Transfer Function (kPa):
V
V
TEMP = 10 to 60°C
Figure 5. Output versus Pressure Differential
out
S
3. The output will saturate outside of the specified
(For additional output filtering, please refer to
= 5.0 Vdc
at ±2.46% V
and Output Filtering Recommendations
= V
shows the recommended decoupling circuit for
and
0.01 μF
S
MAX
*[(0.1533*P) + 0.053] ± 2.46% V
Figure 5
Operating Characteristics)
Application Note AN1646.)
FSS
2.0
Differential Pressure (kPa)
shows the sensor output signal
(with auto zero, Note 5 in
Vs
MIN
+5 V
GND
IPS
FSS
Vout
4.0
Pressure
TYPICAL
MPXV4006
470 pF
OUTPUT
6.0
5