GA200TD120U Vishay, GA200TD120U Datasheet

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GA200TD120U

Manufacturer Part Number
GA200TD120U
Description
IGBT FAST 1200V 200A INT-A-PAK
Manufacturer
Vishay
Datasheet

Specifications of GA200TD120U

Configuration
Half Bridge
Voltage - Collector Emitter Breakdown (max)
1200V
Vce(on) (max) @ Vge, Ic
3.1V @ 15V, 200A
Current - Collector (ic) (max)
200A
Current - Collector Cutoff (max)
2mA
Input Capacitance (cies) @ Vce
37.343nF @ 30V
Power - Max
1040W
Input
Standard
Ntc Thermistor
No
Mounting Type
Chassis Mount
Package / Case
Dual INT-A-PAK (3 + 8)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Igbt Type
-
Other names
VS-GA200TD120U
VS-GA200TD120U
VSGA200TD120U
VSGA200TD120U

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GA200TD120U
Manufacturer:
IR
Quantity:
134
Part Number:
GA200TD120U
Quantity:
64
• Generation 4 IGBT technology
• UltraFast: Optimized for high operating
• Very low conduction and switching losses
• HEXFRED
• Industry standard package
• UL approved
• Increased operating efficiency
• Direct mounting to heatsink
• Performance optimized for power conversion: UPS,
• Lower EMI, requires less snubbing
Absolute Maximum Ratings
"HALF-BRIDGE" IGBT DUAL INT-A-PAK
Benefits
Features
Features
Features
Features
Features
Thermal / Mechanical Characteristics
www.irf.com
V
I
I
I
I
V
V
P
P
T
T
R
R
R
SMPS, Welding
frequencies 8-40 kHz in hard switching, >200
kHz in resonant mode
recovery
C
CM
LM
FM
STG
CES
GE
ISOL
D
D
J
@ T
CS
JC
JC
@ T
@ T
C
C
C
= 25°C
= 25°C
= 85°C
antiparallel diodes with ultra- soft
Collector-to-Emitter Voltage
Continuous Collector Current
Pulsed Collector CurrentQ
Peak Switching Current‚
Peak Diode Forward Current
Gate-to-Emitter Voltage
RMS Isolation Voltage, Any Terminal To Case, t = 1 min
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature Range
Storage Temperature Range
Thermal Resistance, Junction-to-Case - IGBT
Thermal Resistance, Junction-to-Case - Diode
Thermal Resistance, Case-to-Sink - Module
Mounting Torque, Case-to-Heatsink
Mounting Torque, Case-to-Terminal 1, 2 & 3
Weight of Module
Parameter
Parameter
S
S
GA200TD120U
Ultra-Fast
-40 to +150
-40 to +125
Max.
1200
2500
1040
±20
200
400
400
400
540
Typ.
400
0.1
@V
V
GE
V
CE
TM
CES
=
(on) typ.
PD - 50061D
Speed IGBT
15V
Max.
=
0.12
0.20
6.0
5.0
,
1200
I
C
= 2.3V
=
V
200A
Units
Units
°C/W
05/27/02
N m
°C
W
V
A
V
g
.
1

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GA200TD120U Summary of contents

Page 1

... Thermal / Mechanical Characteristics Parameter R Thermal Resistance, Junction-to-Case - IGBT JC R Thermal Resistance, Junction-to-Case - Diode JC R Thermal Resistance, Case-to-Sink - Module CS Mounting Torque, Case-to-Heatsink Mounting Torque, Case-to-Terminal 1, 2 & 3 Weight of Module www.irf.com GA200TD120U Ultra-Fast Max. 1200 200 400 400 400 ±20 2500 1040 540 ...

Page 2

... GA200TD120U Electrical Characteristics @ T Parameter V Collector-to-Emitter Breakdown Voltage (BR)CES V Collector-to-Emitter Voltage CE(on) V Gate Threshold Voltage GE(th) DV /DT Temperature Coeff. of Threshold Voltage GE(th Forward Transconductance Collector-to-Emitter Leaking Current CES V Diode Forward Voltage - Maximum FM I Gate-to-Emitter Leakage Current GES Dynamic Characteristics - T Parameter Q Total Gate Charge (turn-on) ...

Page 3

... Fig Typical Output Characteristics www.irf.com 1 f, Frequency (KHz) (Load Current = I of fundamental) RMS 1000  T = 125 C 100 ° 15V 1 2.5 3.0 5.0 Fig Typical Transfer Characteristics GA200TD120U For both: D uty cy cle: 50 125° 90°C s ink G ate drive as specified Dis sip ation = 160 W 10 ° ° ...

Page 4

... GA200TD120U 250 200 150 100 100 T , Case Temperature ( C) C Fig Maximum Collector Current vs. Case Temperature 0.01 SIN ( Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case PULSE WIDTH 2.0 1.0 125 150 -60 -40 -20 ° Fig Typical Collector-to-Emitter Voltage vs. Junction Temperature 0 ...

Page 5

... Fig Typical Switching Losses vs. Gate Resistance www.irf.com  SHORTED 100 0 Fig Typical Gate Charge vs.  1000 R = 100 -60 -40 -20 Fig Typical Switching Losses vs. GA200TD120U = 400V 249A = 200A 400 800 1200 1600 Q , Total Gate Charge (nC) G Gate-to-Emitter Voltage = 0 = Ohm G2 = 15V = 720V  400 200 100 100 120 140 160 ° ...

Page 6

... GA200TD120U  200 R = Ohm 150 C ° 720V 15V 160 GE 120 100 200 I , Collector Current (A) C Fig Typical Switching Losses vs. Collector-to-Emitter Current 125° 25° 1.0 2.0 3.0 4.0 Fo rward Voltag e D rop - Fig Typical Forward Voltage Drop vs. Instantaneous Forward Current 300 400 ...

Page 7

... 20V ° 5° /dt - (A/µ Fig Typical Reverse Recovery vs. di www.irf.com 400A ° 5° 200A 100A I = 400A 200A 100A /dt Fig Typical Recovery Current vs GA200TD120U /dt - (A/µ / ...

Page 8

... GA200TD120U Fig. 17a - Test Circuit for Measurement off(diode d(on Fig. 17c - Test Waveforms for Circuit of Fig. 18a, Defining d(on ff d(off) f Fig. 17b - Test Waveforms for Circuit of Fig. 18a, Defining Vce Fig. 17d - Test Waveforms for Circuit of Fig. 18a µ S Vce Ic dt ...

Page 9

... Figure 17e. Macro Waveforms for µ Figure 18. Clamped Inductive Load Test Circuit www.irf.com Figure 18a's D.U. 600V Figure 19. Pulsed Collector Current GA200TD120U Test Circuit 600V @25°C C Test Circuit 9 ...

Page 10

... GA200TD120U Notes: Q Repetitive rating 20V, pulse width limited by GE max. junction temperature. R See fig For screws M6. T Pulse width 50µs; single shot. Case Outline — DUAL INT-A-PAK 107.30 [ 4.224 ] 106.30 4.185 93.30 [ 3.673 ] 92.70 3.650 [.314] 28.60 2X MAX. 27. 48.30 1.902 47.70 1 ...

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