LRI2K-A1S/1GE STMicroelectronics, LRI2K-A1S/1GE Datasheet - Page 79

• Manufacturer Part Number: LRI2K-A1S/1GE
• Description: IC MEMORY TAG 64BIT UID ADH ANT
• Manufacturer: STMicroelectronics
• Series: LRI2Kr

Specifications of LRI2K-A1S/1GE

• Rf Type: Read / Write
• Frequency: 13.56MHz
• Features: ISO15693, ISO18000-3, 64-bits
• Package / Case: 76mm x 45mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5533-2

LRI2K
23
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second-level interconnect. The category of
second-level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 62. UFDFPN8 - 8-lead ultra thin fine pitch dual flat package no lead (MLP)
1. Drawing is not to scale.
Table 92.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
Symbol
ddd
measuring.
D2
A1
E2
L1
L3
D
A
E
b
e
L
(2)
outline
UFDFPN8 - 8-lead ultra thin fine pitch dual flat package no lead (MLP)
mechanical data
Typ.
0.55
0.02
0.25
0.45
1.6
0.2
0.5
2
3
A
E
A1
Millimeters
Min.
0.45
0.08
0.2
1.9
1.5
2.9
0.1
0.4
0.3
0
-
D
Max.
0.05
0.15
0.6
0.3
2.1
1.7
3.1
0.3
0.5
-
ddd
L3
0.0217
0.0008
0.0098
0.0787
0.1181
0.0079
0.0197
0.0177
0.063
Typ.
D2
e
b
Package mechanical data
UFDFPN-01
Inches
L1
E2
L
0.0177
0.0079
0.0748
0.0591
0.1142
0.0039
0.0157
0.0118
0.0031
Min.
0
-
(1)
0.0827
0.0236
0.0118
0.0669
0.0118
0.0197
0.0059
0.002
0.122
Max.
®
-
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