T555714-DBW Atmel, T555714-DBW Datasheet - Page 30

• Manufacturer Part Number: T555714-DBW
• Description: MODULE IDIC R/W RFID 33OPF
• Manufacturer: Atmel
• Series: T555714r

Specifications of T555714-DBW

• Rf Type: Read / Write
• Frequency: 125kHz
• Features: 330-bit EEPROM
• Package / Case: DICE
• Screening Level: Industrial
• Package Type: Die
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.1
Figure 10-5. NOA2 Micromodule
30
Failed Die Identification
T5557
Note:
1. Reject hole by device testing
2. Punching cutline
3. Total package thickness
4. Module dimension
Drawing refers to following types: Micromodule
Drawing-No.: 6.549-5034.01-4
Issue: prel.; 25.09.02
Subcontractor: NedCard
recommendation for singulation
excludes punching burr
after galvanic seperation
Dimensions in mm
technical drawings
according to DIN
specifications
Every die on the wafer not passing Atmel test sequence is marked with inch.
The inch dot specification:
• Dot size: 200 µm
• Position: center of die
• Color: black
1.42
4.75
±0.05
+0.02
X5:1
9.5
X
±0.03
0.03
A
2.375
5.15
5.06
B
4.8
Note 2
Note 4
±0.05
A
±0.03
±0.03
4.625
R1.5
2.375
∅ 2
Note 1
B
±0.03
±0.05
0.03 A
R1.1
±0.03
31.83
25.565
21.815
15.915
12.165
6.265
2.515
0
1.585
R0.2 max.
0.38
0.09
Note 3
(4x)
-0.04
-0.01
4517J–RFID–03/06