T555714-DBW Atmel, T555714-DBW Datasheet
T555714-DBW
Specifications of T555714-DBW
Related parts for T555714-DBW
T555714-DBW Summary of contents
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Features • Contactless Read/Write Data Transmission • Radio Frequency f from 100 kHz to 150 kHz RF • e5550 Binary Compatible or T5557 Extended Mode • Small Size, Configurable for ISO/IEC 11784/785 Compatibility • On-chip Resonant Capacitor (Mask ...
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System Block Diagram Figure 2-1. Reader Base station Base station 3. T5557 – Building Blocks Figure 3-1. 3.1 Analog Front End (AFE) The AFE includes all circuits which are directly connected to the coil. It generates the IC’s power ...
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... RF/64, RF/100 and RF/128). 3.3 Write Decoder This function decodes the write gaps and verifies the validity of the data stream according to the Atmel e555x write method (pulse interval encoding). 3.4 HV Generator This on-chip charge pump circuit generates the high voltage required for programming of the EEPROM ...
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Figure 3-2. Block 0 Configuration Mapping – e5550 Compatibility Mode Master Key Note 1 Unlocked 1 Locked 1) If Master Key = 6 then test ...
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... ID of Atmel (= “15”hex). The following 8 bits are used as IC reference byte (ICR bits 47 to 40). The 3 most significant bits define the IC and/or foundry version of the T5557. The lower 5 bits are by default reset (= 00) as the Atmel standard value. Other values may be assigned on request to high volume customers as tag issuer identification. ...
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... Example Allocation class as defined in ISO/IEC 15963-1 = E0h Manufacturer code of Atmel Corporation as defined in ISO/IEC 7816-6 = 15h IC reference of silicon and/or tag manufacturer Top 3 bits define IC revision Lower 5 bits may contain a customer ID code on request Manufacturer serial number consists of: 5-digit lot number, e.g., “38765” ...
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Regular-read Mode In regular-read mode data from the memory is transmitted serially, starting with block 1, bit the last block (e.g., 7), bit 32. The last block which will be read is defined by the mode ...
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In the regular-read mode, the sequence terminator is inserted at the start of each MAXBLK-limited read data stream. In block-read mode – after any block-write or direct access command – MAXBLK was set the ...
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Figure 4-4. Table 4-1. Parameters Start gap Write gap Write data in normal mode 4.8 Write Data Protocol The T5557 expects to receive a dual bit opcode as the first two bits of a reader command sequence. There are three ...
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Figure 4-5. Complete Writing Sequence Read mode T55571x T555701 Start gap Block 0 loading POR Figure 4-6. T5557 Command Formats Standard write Protected write AOR (wake-up command) Direct access (PWD = 1) Direct access (PWD = 0) Page 0/1 regular ...
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Answer-On-Request (AOR) Mode When the AOR bit is set, the T5557 does not start modulation in the regular-read mode after loading configuration block 0. The tag waits for a valid AOR data stream (“wake-up command”) from the reader before ...
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Figure 4-9. Anticollision Procedure Using AOR Mode Reader init tags with AOR = "1" , PWD = "1" wait for t "Select a single tag" send OPCODE + PWD => "wake up command" decode data NO all tags read ? ...
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Programming When all necessary information has been received by the T5557, programming may proceed. There is a clock delay between the end of the writing sequence and the start of programming. Typical programming time is 5.6 ms. This cycle ...
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Figure 5-1. T5557 Functional Diagram * p = page selector Page 0 gap single gap Modulation Defeat Reset to page 0 Data verification failed 6. T5557 in Extended Mode (X-mode) In general, the block 0 setting of the master key ...
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Binary Bit-rate Generator In extended mode the data rate is binary programmable to operate at any data rate between RF/2 and RF/128 as given in the formula below. Data rate = RF/(2n+2) 6.2 OTP Functionality If the OTP bit ...
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Sequence Start Marker Figure 6-2. T5557 Sequence Start Marker in Extended Mode Sequence Start Marker 10 Block n Block-read mode 10 Block 1 Regular-read mode The T5557 sequence start marker is a special damping pattern, which may be used ...
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Fast Write In the optional fast write mode the time between two gaps is nominally 12 field clocks for a “0” and 27 field clocks for a “1”. When there is no gap for more than 32 field clocks ...
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Figure 6-4. T5557 18 Example of Manchester Coding with Data Rate RF/16 4517J–RFID–03/06 ...
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Figure 6-5. 4517J–RFID–03/06 Example of Biphase Coding with Data Rate RF/16 T5557 19 ...
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Figure 6-6. T5557 20 Example: FSK1a Coding with Data Rate RF/40, Subcarrier f = RF/ RF 4517J–RFID–03/06 ...
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Figure 6-7. 4517J–RFID–03/06 Example of PSK1 Coding with Data Rate RF/16 T5557 21 ...
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Figure 6-8. T5557 22 Example of PSK2 Coding with Data Rate RF/16 4517J–RFID–03/06 ...
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Figure 6-9. 4517J–RFID–03/06 Example of PSK3 Coding with Data Rate RF/16 T5557 23 ...
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... AC coil voltage measurement setup 2.3 kΩ; V mod 4. Since EEPROM performance is influenced by assembly processes, Atmel confirms the parameters for DOW (tested dice on uncutted wafer) delivery. 5. The tolerance of the on-chip resonance capacitor C ±3% at 3σ wafer basis. ...
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... AC coil voltage measurement setup 2.3 kΩ; V mod 4. Since EEPROM performance is influenced by assembly processes, Atmel confirms the parameters for DOW (tested dice on uncutted wafer) delivery. 5. The tolerance of the on-chip resonance capacitor C ±3% at 3σ wafer basis. ...
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... For available order codes refer to Atmel Sales/Marketing. 9.1 Ordering Examples (Recommended) T555711-DDW 9.2 Available Order Codes T555711-DDW, DDT T555714-DDW T555715-PAE ATA555711-TASY New order codes will be done on customer request if order quantities are upside 250k pieces. T5557 26 (2) - Dice on wafer, 6” un-sawn wafer, thickness 300 µm - Dice in tray (waffle pack), thickness 300 µ ...
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Package Information Figure 10-1. 2 Pad Layout for Wire Bonding Dimensions in µm 124 87 4517J–RFID–03/06 994 125 C2 497 T5557 149.5 27 ...
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Figure 10-2. 4 Pad Flip-chip Version with 70 µm Solder Bumps Dimensions in µm 124 97 107 Figure 10-3. Solder Bump on NiAu 70 µm T5557 28 994 82 60 100 C2 497 AL bondpad 157 PbSn Ni Passivation 4517J–RFID–03/06 ...
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Figure 10-4. Wafer Map Die: 0.894 × 0.864, Step: 0.994 × 0.934 × 7, Frame Step: 13.916 × 15.878 > Shift-ASML = [0.3; –6.9] : 15539 dice, 87 shots (11 cols × 9 rows) > Shift-CANON/ALARM/SEM = [0.3; ...
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... Failed Die Identification Every die on the wafer not passing Atmel test sequence is marked with inch. The inch dot specification: • Dot size: 200 µm • Position: center of die • Color: black Figure 10-5. NOA2 Micromodule technical drawings according to DIN specifications ...
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Figure 10-6. Shipping Reel Ø171 4517J–RFID–03/06 Ø329,6 120˚ (3x) R1,14 2,3 Ø13 Ø175 16,7 T5557 41,4 to max 43,0 2 2,2 31 ...
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Figure 10-7. SO8 Package Package SO8 Dimensions in mm Figure 10-8. Pinning SO8 T5557 32 5.00 4.85 1.4 0.25 0.4 0.10 1.27 3. technical drawings according to DIN specifications 1 4 COIL2 1 8 COIL1 ...
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Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. 4517J-RFID-03/06 4517I-RFID-11/05 4517H-RFID-08/05 4517J–RFID–03/06 History • Section 9.1 “Ordering Examples (Recommended) changed • ...
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... Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT ...