HTSFCH4801EV/DH,11 NXP Semiconductors, HTSFCH4801EV/DH,11 Datasheet - Page 3

• Manufacturer Part Number: HTSFCH4801EV/DH,11
• Description: IC HITAG-S 2048BIT FCP
• Manufacturer: NXP Semiconductors
• Series: HITAG® Sr

Specifications of HTSFCH4801EV/DH,11

• Rf Type: Read / Write
• Frequency: 125kHz
• Features: ISO11785, ISO14223
• Package / Case: Flip-Chip-2
• Product: RFID Transponders
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2211-2; 935272977118; HTSFCH4801EV/DH-T

Philips Semiconductors
1
• Integrated Circuit for Contactless Identification
• Integrated resonance capacitor of 210 pF with ± 5 %
• Frequency range 100..150 kHz.
1.1
• Modulation Read/Write Device → Transponder:
• Modulation Transponder → Read/Write Device: Strong
• Fast Anticollision Protocol for inventory tracking:
• Data integrity check (CRC)
• Optional Transponder Talks First Modes with user
• Temporary switch from Transponder Talks First into
• Data Rate Read/Write Device to Transponder: 5.2 kBit/s
• Data Rates Transponder to Read/Write Device: 2 kBit/s,
1.2
• Three memory options (32 Bit UID, 256 Bit, 2048 Bit)
• More than 100000 erase/write cycles
• 10 years non - volatile data retention
• Secure Memory Lock functionality
1.3
• Full compliant to ISO 11784/85 Animal ID
• Targeted to operated on hardware infrastructure of new
• Supports German Waste Management Standard and
Transponders and Cards
tolerance over full production
100 % ASK and Binary Pulse Length Coding
ASK modulation with Anticollision, Manchester and
Biphase Coding
100 Tags in 3.2 seconds
defined data length
Reader Talks First Mode
4 kBit/s, 8 kBit/s
upcoming standards
– ISO14223
– ISO 18000-2
Pigeon Race Standard
HITAG S
FEATURES
(Animal ID with anticollision and read/write
functionality)
(AIDC Techniques-RFID or Item Management)
Protocol
Memory
Supported Standards
3
HTS IC H32/HTS IC H56/HTS IC H48
1.4
• 32 Bit Unique Identification Number (UID)
• 48 Bit secret key based encrypted authentication
1.5
• Sawn, gold - bumped 8” Wafer
• Contactless Chip Card Module MOA2
• I – Connect (Low Cost Flip Chip Package)
Security Features
Delivery Types
Product Specification Revision 3.1 2006 July 18
PUBLIC INFORMATION