UGW3S8XESM33 Unigen Corp, UGW3S8XESM33 Datasheet - Page 35

• Manufacturer Part Number: UGW3S8XESM33
• Description: MODULE PAN-SMT-800 MOBO
• Manufacturer: Unigen Corp

Specifications of UGW3S8XESM33

• Frequency: 868MHz ~ 870MHz
• Data Rate - Maximum: 152.3kbps
• Modulation Or Protocol: FSK
• Power - Output: 15dBm
• Sensitivity: -111dBm
• Voltage - Supply: 2.4 V ~ 3.6 V
• Current - Receiving: 14mA
• Current - Transmitting: 62mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Applications: -
• Memory Size: -
• Other names: 784-1028-2

Solutions for a Real Time World
Solder Profiles
Preliminary information subject to change.
Re-Tek - 1533
94539
[e-mail]
http://www.unigen.com
Printing/Dispensing
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Printing/Dispensing
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Stencil: 0.006 inch (6 mil)
Squeegee: Metal
(recommended)
Stencil: 0.006 inch (6 mil)
Squeegee: Metal
(recommended)
Recommended Soldering Parameters (non-RoHS Compliant)
Recommended Soldering Parameters (RoHS Compliant)
PAN 433/868/902 MHz - UGW3S
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Ramp @ 1.0 – 2.0ºC/sec to 130ºC
Slow ramp from 130ºC to 180ºC for 90- 120 seconds
Ramp @ 0.5- 2ºC /sec to peak temperature 230ºC to
250ºC TAL for 40- 80 seconds
Ramp down to R.T. @ 1- 3ºC/sec
Straight ramp up profile preferred
Ramp up from ambient temp. to peak temp. of 210ºC to
225ºC @ 1ºC /sec
TAL (Time Above Liquidus) = 45 to 75 seconds
Ramp down to R.T. @ 1- 3ºC/sec
Copyright Unigen Corporation, 2008
Reflow Profile
Reflow Profile
- 35 -
TEL: [phone] FAX: [phone]
Customer Comment Line: [phone]
45388 Warm Springs Blvd. Fremont, CA
Please note that the reflow
profiles listed are
guidelines only and
adjustments may be
necessary to ensure proper
wetting of the solder.
Please note that the reflow
profiles listed are
guidelines only and
adjustments may be
necessary to ensure proper
wetting of the solder.
Note
Note
Datasheet