SI4200-GM Silicon Laboratories Inc, SI4200-GM Datasheet - Page 45

• Manufacturer Part Number: SI4200-GM
• Description: IC TXRX TRI-BAND 32MLP
• Manufacturer: Silicon Laboratories Inc

Specifications of SI4200-GM

• Frequency: 850MHz, 900MHz, 1.8GHz
• Modulation Or Protocol: GSM
• Applications: Cellular, GSM Cellular Radio
• Voltage - Supply: 2.7 V ~ 3.3 V
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Package Outline: Si4134T-BM
Figure 18 illustrates the package details for the Si4134T-BM. Table 12 lists the values for the dimensions shown in
the illustration.
0.50 DIA.
PIN1 ID
Notes:
Symbol
D, E
1. Dimensioning and tolerances conform to ASME Y14.5M. - 1994
2. Package warpage MAX 0.05 mm.
3. “b” applies to plated terminal and is measured between 0.20 and 0.25 mm from terminal TIP.
4. The package weight is approximately 66 mg.
5. The mold compound for this package has a flammability rating of UL94-V0 with an oxygen index of 28
6. The recommended reflow profile for this package is defined by the JEDEC-020B Small Body specification.
A1
A2
A3
1
2
3
A
b
minimum/54 typical.
32
Top View
0.00
0.18
Min
D1
D
—
—
Figure 20. 32-Pin Micro Leadframe Package (MLP)
Millimeters
0.20 REF.
5.00 BSC
Nom
0.85
0.01
0.65
0.23
E1
Table 14. Package Dimensions
E
Max
0.90
0.05
0.70
0.30
θ
A2
Rev. 1.2
A
Side View
Symbol
b
e
A1
A3
D1, E1
D2, E2
e
L
θ
L
b
e
0.30
2.95
Min
—
Bottom View
Millimeters
4.75 BSC
0.50 BSC
Nom
3.10
0.40
—
D2
32
Aero+
Max
3.25
0.50
12°
1
2
3
PIN1 ID
0.20 R.
E2
45