GS-BT2416C1.AT1 STMicroelectronics, GS-BT2416C1.AT1 Datasheet - Page 16

• Manufacturer Part Number: GS-BT2416C1.AT1
• Description: BLUETOOTH CLASS 1 SPP W/SOFTWARE
• Manufacturer: STMicroelectronics

Specifications of GS-BT2416C1.AT1

• Frequency: 2.4GHz
• Data Rate - Maximum: 721kbps
• Modulation Or Protocol: Bluetooth v2.1+EDR, class 1
• Applications: General Purpose
• Power - Output: 20dBm
• Sensitivity: -84dBm
• Voltage - Supply: 3.3V
• Current - Receiving: 60mA
• Current - Transmitting: 180mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -20°C ~ 70°C
• Package / Case: Module
• Processor Series: STLC2500
• Wireless Frequency: 2.4 GHz to 2.5 GHz
• Interface Type: SPI, I2C, UART, PCM
• Data Rate: 721 Kbps
• Modulation: USB, UART, PCM, SPI, IýC
• Output Power: 100 mW
• For Use With: 497-6224 - DEMO BOARD FOR GS-BT2416C2.ATI497-6223 - DEMO BOARD FOR GS-BT2416C2.H497-5792 - BOARD DEMO FOR CLASS 1 MODULES
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-5789

Soldering
9
16/38
Soldering
Soldering phase has to be execute with care: in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Table 8.
Figure 9.
Average ramp up rate (T
Temperature min (T
Temperature max (T
Time (t
Temperature T
Time t
Peak temperature (T
Time within 5 °C of actual peak temperature (t
Ramp down rate
Time from 25 °C to peak temperature
L
S
min to t
Time maintained above:
Soldering
Soldering
L
S
Profile feature
max) (t
Preheat
S
S
p
min)
)
max)
SMAX
S
)
to T
P
)
P
)
PB free assembly
3 °C / sec max
8 minutes max
60 – 100 sec
40 – 70 sec
10 – 20 sec
240 + 0 °C
6 °C / sec
150 °C
200 °C
217 °C
GS-BT2416C1.AT1