XBP24-ACI-001 Digi International/Maxstream, XBP24-ACI-001 Datasheet - Page 6
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XBP24-ACI-001
Manufacturer Part Number
XBP24-ACI-001
Description
MODULE 802.15.4 100MW CHIP ANT
Manufacturer
Digi International/Maxstream
Series
XBEE-PRO™r
Specifications of XBP24-ACI-001
Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4
Applications
Home/Building Automation, Industrial Control, ZigBee™
Power - Output
20dBm (100mW)
Sensitivity
-100dBm
Voltage - Supply
2.8 V ~ 3.4 V
Current - Receiving
55mA
Current - Transmitting
215mA @ 3.3V
Data Interface
PCB, Through Hole
Antenna Connector
On-Board, Chip
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
XBee®/XBee‐PRO® RF Modules ‐ 802.15.4 ‐ v1.xEx [2009.09.23]
Mounting Considerations
The XBee and XBee‐PRO RF Modules are pin‐for‐pin compatible.
The XBee®/XBee-PRO® RF Module was designed to mount into a receptacle (socket) and there-
fore does not require any soldering when mounting it to a board. The XBee Development Kits con-
tain RS-232 and USB interface boards which use two 20-pin receptacles to receive modules.
Figure 1‐02. XBee Module Mounting to an RS‐232 Interface Board.
The receptacles used on Digi development boards are manufactured by Century Interconnect.
Several other manufacturers provide comparable mounting solutions; however, Digi currently uses
the following receptacles:
Digi also recommends printing an outline of the module on the board to indicate the orientation the
module should be mounted.
© 2009 Digi Internatonal, Inc.
• Through-hole single-row receptacles -
• Surface-mount double-row receptacles -
• Surface-mount single-row receptacles -
Samtec P/N: MMS-110-01-L-SV (or equivalent)
Century Interconnect P/N: CPRMSL20-D-0-1 (or equivalent)
Samtec P/N: SMM-110-02-SM-S
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