ADL5375-05ACPZ-R7 Analog Devices Inc, ADL5375-05ACPZ-R7 Datasheet - Page 28

• Manufacturer Part Number: ADL5375-05ACPZ-R7
• Description: IC MOD QUAD 400MHZ-6GHZ 24LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADL5375-05ACPZ-R7

• Design Resources: Interfacing ADL5375 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0021) Broadband Low EVM Direct Conversion Transmitter (CN0134)
• Function: Modulator
• Lo Frequency: 400MHz ~ 6GHz
• Rf Frequency: 400MHz ~ 6GHz
• P1db: 10.4dBm
• Noise Floor: -157.6dBm/Hz
• Output Power: 1.71dBm
• Current - Supply: 200mA
• Voltage - Supply: 4.75 V ~ 5.25 V
• Test Frequency: 3.5GHz
• Package / Case: 24-VFQFN, 24-CSP Exposed Pad
• Frequency Range: 400MHz To 6GHz
• Rf Type: Quadrature
• Supply Voltage Range: 4.75V To 5.25V
• Rf Ic Case Style: LFCSP
• No. Of Pins: 24
• Operating Temperature Range: -40°C To +85°C
• Frequency Max: 6GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADL5375-05ACPZ-R7TR

Figure 72. Evaluation Board Layout, Bottom Layer
Figure 71. Evaluation Board Layout, Top Layer
Rev. A | Page 28 of 32
THERMAL GROUNDING AND EVALUATION
BOARD LAYOUT
The package for the ADL5375 features an exposed paddle on
the underside that should be well soldered to a low thermal
and electrical impedance ground plane. This paddle is typically
soldered to an exposed opening in the solder mask on the
evaluation board. Figure 73 illustrates the dimensions used
in the layout of the ADL5735 footprint on the ADL5375
evaluation board (1 mil. = 0.0254 mm).
Notice the use of nine via holes on the exposed paddle. These
ground vias should be connected to all other ground layers on
the evaluation board to maximize heat dissipation from the
device package.
Figure 73. Dimensions for Evaluation Board Layout for the ADL5375 Package
Under these conditions, the thermal impedance of the ADL5375
was measured to be approximately 30°C/W in still air.
19.7 mil.
25 mil.
133.8 mil.
12 mil.
98.4 mil.
23 mil.
12 mil.
82 mil.
ADL5375