SA676DK/01,112 NXP Semiconductors, SA676DK/01,112 Datasheet
SA676DK/01,112
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SA676DK/01
SA676DK/01
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SA676DK/01,112 Summary of contents
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SA676 Low-voltage mixer FM IF system Rev. 2 — 12 April 2011 1. General description The SA676 is a low-voltage monolithic FM IF system incorporating a mixer/oscillator, two limiting intermediate frequency amplifiers, quadrature detector, logarithmic Received Signal Strength Indicator (RSSI), ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information − ° ° +85 C amb Type number Topside Package mark Name SA676DK/01 SA676DK SSOP20 5. Block diagram Fig 1. SA676 Product data sheet Description plastic shrink small outline package; 20 leads; body width 4 amp mixer OSC Block diagram All information provided in this document is subject to legal disclaimers. Rev. 2 — ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 2. Symbol RF_IN RF_IN_DECOUPL OSC_OUT OSC_IN RSSI_OUT V CC AUDIO_FEEDBACK AUDIO_OUT RSSI_FEEDBACK QUADRATURE_IN LIMITER_OUT LIMITER_DECOUPL LIMITER_DECOUPL LIMITER_IN GND IF_AMP_OUT IF_AMP_DECOUPL IF_AMP_IN IF_AMP_DECOUPL MIXER_OUT SA676 Product data sheet RF_IN 1 RF_IN_DECOUPL 2 OSC_OUT 3 4 OSC_IN ...
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... NXP Semiconductors 7. Functional description The SA676 signal processing system suitable for second IF systems with input frequency as high as 100 MHz. The bandwidth of the IF amplifier and limiter is at least 2 MHz with gain. The gain/bandwidth distribution is optimized for 455 kHz, 1.5 kΩ source applications. The overall system is well-suited to battery operation as well as high performance and high quality products of all types ...
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... NXP Semiconductors 8. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg T amb 9. Thermal characteristics Table 4. Symbol Z th(j-a) 10. Static characteristics Table Symbol SA676 Product data sheet Limiting values Parameter Conditions supply voltage storage temperature ambient temperature ...
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... NXP Semiconductors 11. Dynamic characteristics Table 6. Dynamic characteristics ° unless specified otherwise. RF frequency = 45 MHz + 14.5 dBV RF input step-up. amb CC IF frequency = 455 kHz; R17 = 2.4 k deviation. Audio output with de-emphasis filter and C-message weighted filter. Test circuit below are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the ultimate performance limits of the device ...
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... NXP Semiconductors 12. Performance curves I CC (mA) Fig 3. G p(conv) (dB) Fig 4. SA676 Product data sheet −55 −35 −15 5 Supply current versus ambient temperature 18 2 3.0 V 7.0 V 17.5 17.0 16.5 16.0 −40 −20 0 Conversion power gain versus ambient temperature All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors (1) Fund product. (2) Third order product. (3) 50 Ω input. Fig 5. relative level (dB) Fig 6. SA676 Product data sheet 20 IF output power (dBm) 0 −20 −40 (1) −60 −80 −66 − MHz 455 kHz. Mixer third order intercept and compression 5 −5 −15 −25 AM rejection − ...
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... NXP Semiconductors V o(RSSI) (V) Fig 7. V o(aud) (mV) Fig 8. SA676 Product data sheet 2.1 1.8 1.5 1.2 0.9 0.6 0.3 −125 −105 RSSI output voltage versus RF level 300 200 5.0 V 3.0 V 2.7 V 100 0 −55 −35 −15 5 Audio output voltage versus ambient temperature All information provided in this document is subject to legal disclaimers. Rev. 2 — ...
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... NXP Semiconductors 13. Application information Fig 9. SA676 Product data sheet FL1 C23 mixer OSC MHz C5 input C6 The layout is very critical in the performance of the receiver. We highly recommend our demo board layout. All of the inductors, the quad tank, and their shield must be grounded μ μF or higher value tantalum capacitor on the supply line is essential. A low frequency ESR screening test on this capacitor will ensure consistent good sensitivity in production. A 0.1 μ ...
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... NXP Semiconductors Table 7. Component C1 C2 C5, C9, C14, C17, C18, C21, C23, C26 C6 C7 C8, C15 C10 C12 C19 C27 FL1, FL2 IFT1 [3] R5 R10 R11 R17 R18 R19 [1] This value can be reduced when a battery is the power source. [2] This kHz bandwidth 455 kHz ceramic filter. All the characterization and testing are done with this wideband filter ...
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... NXP Semiconductors AUDIO Fig 10. SA6x6DK/SA58640DK top view with components SA676 Product data sheet SA6x6DK SA58640DK L1 C6 TOKO R11 44.545 MHz X1 R10 RSSI C27 C10 C9 VCC C12 GND 820 Ω 4.7 nF AUDIO_DC All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 April 2011 ...
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... NXP Semiconductors Fig 11. SA6x6DK/SA58640DK bottom view (viewed from top) SA676 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 April 2011 SA676 Low-voltage mixer FM IF system 001aal892 © NXP B.V. 2011. All rights reserved ...
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... NXP Semiconductors 14. Test information (1) Set RF generator at 45.000 MHz; use a 1 kHz modulation frequency and a 6 kHz deviation if using (2) The smallest RSSI voltage (i.e., when no RF input is present and the input is terminated (3) The C-message and de-emphasis filter combination has a peak gain for accurate (4) The measured typical sensitivity for 12 dB SINAD should be 0.45 μ ...
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... NXP Semiconductors 15. Package outline SSOP20: plastic shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.4 mm 1.5 0.25 0 1.2 Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION IEC SOT266-1 Fig 13 ...
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... NXP Semiconductors 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 14. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 10. Acronym AM ESD ESR RMS RSSI SA676 Product data sheet maximum peak temperature = MSL limit, damage level ...
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... NXP Semiconductors 18. Revision history Table 11. Revision history Document ID Release date SA676 v.2 20110412 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 5 10 Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Performance curves . . . . . . . . . . . . . . . . . . . . . 7 13 Application information ...