SA606DK/01,112 NXP Semiconductors, SA606DK/01,112 Datasheet - Page 24

• Manufacturer Part Number: SA606DK/01,112
• Description: IC MIXER FM IF SYSTEM LV 20-SSOP
• Manufacturer: NXP Semiconductors
• Series: SA606r

Specifications of SA606DK/01,112

• Package / Case: 20-SSOP
• Noise Figure: 6.2dB
• Rf Type: Cellular, ASK, FSK, VHF
• Frequency: 150MHz
• Number Of Mixers: 2
• Gain: 17dB
• Secondary Attributes: Up Converter
• Current - Supply: 3.5mA
• Voltage - Supply: 2.7 V ~ 7 V
• Operating Frequency: 150 MHz
• Supply Voltage (max): 7 V
• Supply Voltage (min): 2.7 V
• Operating Temperature Range: - 40 C to + 85 C
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-5044; 935275286112; SA606DK/01; SA606DK/01,112; SA606DK/01

NXP Semiconductors
SA606
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 9.
Table 10.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
10
23.
Rev. 4 — 12 April 2011
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
Low-voltage high performance mixer FM IF system
3
3
)
)
Figure
350 to 2000
260
250
245
23) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
© NXP B.V. 2011. All rights reserved.
SA606
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