ISL5239KIZ Intersil, ISL5239KIZ Datasheet - Page 31

• Manufacturer Part Number: ISL5239KIZ
• Description: IC LINEARIZER PRE-DISTORT 196BGA
• Manufacturer: Intersil

Specifications of ISL5239KIZ

• Function: Pre-Distortion Linearizer
• Rf Type: CDMA2000, UMTS
• Secondary Attributes: Sample Rates to 125MSPS
• Package / Case: 196-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Plastic Ball Grid Array Packages (BGA)
o
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
A1 CORNER I.D.
A1 CORNER
0.006
0.003
0.15
0.08
A
C
S
M
M
b
A
C
C
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
A B
A1
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
A2
14
13
12 11 10 9
BOTTOM VIEW
S
31
SIDE VIEW
TOP VIEW
A
8
D1
D
7 6 5
4
3
SEATING PLANE
ALL ROWS AND COLUMNS
2
1
A
e
E
A
B
C
D
E
F
G
H
J
K
L
M
N
P
B
E1
bbb
A1
CORNER
A1
CORNER I.D.
aaa
C
ISL5239
C
V196.15x15
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
NOTES:
SYMBOL
1. Controlling dimension: MILLIMETER. Converted inch
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
6. Dimension “A” includes standoff height “A1”, package body
7. Dimension “b” is measured at the maximum ball diameter,
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
MD/ME
D1/E1
D/E
bbb
aaa
A1
A2
dimensions are not necessarily exact.
and “E” dimensions, respectively.
ical crowns of the contact balls.
thickness and lid or cap height “A2”.
parallel to the primary datum C.
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
N
A
b
e
0.012
0.037
0.016
0.587
0.508
MIN
-
0.039 BSC
INCHES
14 x 14
0.004
0.005
196
0.016
0.044
0.516
MAX
0.059
0.020
0.595
14.90
12.90
0.31
0.93
0.41
MILLIMETERS
MIN
-
1.0 BSC
14 x 14
0.10
0.12
196
15.10
13.10
MAX
1.50
0.41
1.11
0.51
Rev. 1 12/00
NOTES
7
3
-
-
-
-
-
-
-
-
-