2450DP15E5400E Johanson Technology Inc, 2450DP15E5400E Datasheet - Page 53

• Manufacturer Part Number: 2450DP15E5400E
• Description: DIPLEXER LPF/BPF 2.45/5.4GHZ
• Manufacturer: Johanson Technology Inc

Specifications of 2450DP15E5400E

• Frequency Bands (low / High): 2.4GHz ~ 2.5GHz / 4.9GHz ~ 5.9GHz
• Low Band Attenuation (min / Max Db): 20.00dB / 0.70dB
• High Band Attenuation (min / Max Db): 17.00dB / 1.60dB
• Return Loss (low Band / High Band): 9.5dB / 9.5dB
• Mounting Type: Surface Mount
• Package / Case: 1206 (3216 Metric)
• Return Loss: 9.5dB
• Bandpass Insertion Loss Max: 1.6dB
• Attenuation @ Reject Band Min: 17dB
• Termination Type: SMD
• Rohs Compliant: Yes
• Capacitance: 0µF
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Other names: 2450DP15E5400; 2450DP15E5400

SLC T
M
E
BOND STRENGTH:
SHEAR STRENGTH:
SOLDER HEAT RESISTANCE:
SOLDERABILITY:
SHOCK:
THERMAL SHOCK:
METALLIZATION TYPE
TERMINATION CODE
ATTACHMENT
COMPATIBILITY
SLC thick-film terminations ( legacy codes “G” and “9”) are still supported. Contact the factory for compatibility information.
NVIRONMENTAL
ETALLIZATION
EMPERATURE
-100%
-20%
-40%
-60%
-80%
0%
C
C
HARACTERISTICS FOR
-35
HARACTERISTICS FOR
C
Exceeds MIL-S-883, Meth. 2011
Exceeds MIL-S-883, Meth. 2019
MIL-S-202, Meth. 210-C, (260±5°C, 5 sec.)
MIL-S-202, Meth. 208, (245±5°C, 5 sec.)
MIL-S-202, Meth. 213-I, (100g, 6 msec.)
MIL-S-202, Meth. 107, A, (-55 to +125°C)
HARACTERISTICS
-25
TiW/Au (Titanium-Tungsten/Gold)
T
Wire / Ribbon Bonding
Silver or Gold Conductive Epoxy
Au/Ge or Au/Si Eutectic Preform
Excellent High Temperature
Resistance (400°C)
Unsuitable for Pb/Sn or Au/Sn Soldering
-15
www.johansontechnology.com
www.johansontechnology.com
-5
GBBL / SLC
GBBL / SLC
5
Temperature (°C)
15
Y (+22% -82%)
Z (+22% -56%)
25
J
VIBRATION:
BURN-IN/LIFE TEST:
LOW VOLTAGE HUMIDITY:
BAROMETRIC PRESSURE:
IMMERSION/SALT SPRAY:
MOISTURE RESISTANCE:
35
TiW/Ni/Au (Titanium-Tungsten/Nickel/Gold)
N
Pb/Sn or Au/Sn Soldering
Au/Sn Eutectic Preform
Moderate High Temp. Resistance (325°C)
Long term high temperature may cause Ni
diffusion and wire bond problems on Au/Ge
45
MIL-S-202, Meth. 204-G, (30g, 10-2000 Hz)
55
65
MIL-S-202, Meth. 108, A/F
Mil-C-49464, Para. 3.17
MIL-S-202, Meth. 105, B
MIL-S-202, Meth. 104, B
MIL-S-202, Meth. 106
75
85
J
53