MF1SPLUS6001DUD/03 NXP Semiconductors, MF1SPLUS6001DUD/03 Datasheet
MF1SPLUS6001DUD/03
Specifications of MF1SPLUS6001DUD/03
Related parts for MF1SPLUS6001DUD/03
MF1SPLUS6001DUD/03 Summary of contents
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MF1SPLUSx0y1 Mainstream contactless smart card IC for fast and easy solution development Rev. 3.1 — 19 April 2010 187031 1. General description Migrate classic contactless smart card systems to the next security level! MIFARE Plus brings benchmark security to mainstream ...
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... NXP Semiconductors Number of single write operations: 200000 cycles (typical) Common Criteria Certification: EAL4+ 3. Applications Public transportation Access management such as employee, school or campus cards Electronic toll collection Closed loop micro payment Car parking Internet cafés Loyalty programs 4. Quick reference data Table 1. ...
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... Table 2. Ordering information Type number Package Commercial Name MF1SPLUS8001DUD/03 FFC MF1SPLUS8001DA4/03 MOA4 MF1SPLUS8011DUD/03 FFC MF1SPLUS8011DA4/03 MOA4 MF1SPLUS8021DUD/03 FFC MF1SPLUS8021DA4/03 MOA4 MF1SPLUS6001DUD/03 FFC MF1SPLUS6001DA4/03 MOA4 MF1SPLUS6011DUD/03 FFC MF1SPLUS6011DA4/03 MOA4 MF1SPLUS6021DUD/03 FFC MF1SPLUS6021DA4/03 MOA4 MF1SPLUSX0Y1_SDS_31 Product short data sheet PUBLIC Name Description - 8 inch wafer (sawn; 120 µm thickness, on film frame carrier ...
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... NXP Semiconductors 6. Block diagram INTERFACE SECURITY SENSORS POWER ON REGULATOR INPUT FILTER GENERATOR Fig 1. 7. Pinning information 7.1 Smart card contactless module Fig 2. Table 3. Contactless interface module Antenna contacts LA LB MF1SPLUSX0Y1_SDS_31 Product short data sheet PUBLIC UART RF ISO/IEC 14443A RESET VOLTAGE CLOCK ...
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... NXP Semiconductors 8. Functional description 8.1 Memory organization The 4 kB EEPROM memory (MF1SPLUS80x) is organized in 32 sectors of 4 blocks and in 8 sectors of 16 blocks. The 2 kB EEPROM memory (MF1SPLUS60x) is organized in 32 sectors of 4 blocks. One block consists of 16 bytes. SECTOR BLOCK ... ... ...
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... NXP Semiconductors Value blocks are special counters where the stored value can be manipulated with specific commands such as MF Increment, MF Decrement and MF Transfer. These value blocks have a fixed data format enabling error detection and correction with backup management to be performed. Value blocks are only available in security level 1. ...
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... NXP Semiconductors There are three different versions of the PICC. The first two have the UID programmed into a locked part of the NV-memory which is reserved for the manufacturer: • the first is a unique 7-byte serial number • the second is a unique 4-byte serial number Due to security and system requirements, these bytes are write-protected after being programmed by the PICC manufacturer at production ...
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... The timings may differ from the MIFARE Classic 1K and MIFARE Classic 4K products. Using the originality function possible to verify that the chip is a genuine NXP Semiconductors MIFARE Plus. MF1SPLUSX0Y1_SDS_31 Product short data sheet PUBLIC Ref ...
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... NXP Semiconductors 8.6 Security level 3 The operation in security level 3 is solely based on the ISO/IEC 14443-4 protocol layer. The usage of the backwards compatibility protocol is not possible. In security level 3, a mandatory AES authentication between PICC and reader is conducted, where two keys are generated as a function of the random numbers from the PICC and the reader as well as of the shared key ...
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... NXP Semiconductors 9.2 Security level ISO/IEC 14443-4 Table 5. Command RATS PPS DESELECT Please find more information on ISO/IEC 14443 in ATQA, SAK and ATS in 9.3 Security level 0 command overview Table 6. Command Write Perso Commit Perso First Authenticate (part 1) Following Authenticate (part 1) following authenticate Authenticate (part 2) 9 ...
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... NXP Semiconductors Table 7. MF1ICS50, MF1ICS70, MF1ICS20 commands Command set for security level switch and originality function using ISO/IEC 14443-4 protocol First Authenticate (part 1) Following Authenticate (part 1) Authenticate (part 2) 9.5 Security level 3 command overview Table 8. Command MIFARE Plus commands First Authenticate (part 1) ...
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... NXP Semiconductors 11. Abbreviations Table 10. Acronym AES EEPROM LCR MAC NV PCD PICC PPS RATS REQA SAK SECS-II UID VC WUPA 12. References [1] Data sheet — MF1ICS50 Functional specification, BU-ID Doc. No. 0010** [2] Data sheet — MF1ICS70 Functional specification, BU-ID Doc. No. 0435**. [3] Data sheet — M1PLUSx0y1 MIFARE Plus functional specification, BU-ID Doc ...
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... NXP Semiconductors 13. Revision history Table 11. Revision history Document ID Release date MF1SPLUSx0y1_31 20100419 • Modifications: Minor text and standardization modifications. 187030 20100211 MF1SPLUSX0Y1_SDS_31 Product short data sheet PUBLIC Data sheet status Product short data sheet Product short data sheet All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 16. Tables Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3 Table 3. Bonding pad assignments to smart card contactless module . . . . . . . . . . . . . . . . . . . . . .4 Table 4. ISO/IEC 14443 Table 5. ISO/IEC 14443 .10 17. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Fig 2. Contact assignments for SOT500-2 (MOA4 Fig 3. Memory organization . . . . . . . . . . . . . . . . . . . . . . .5 MF1SPLUSX0Y1_SDS_31 Product short data sheet PUBLIC Table 6 ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Smart card contactless module . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 Memory organization . . . . . . . . . . . . . . . . . . . . 5 8.1.1 Manufacturer block . . . . . . . . . . . . . . . . . . . . . . 5 8.1.2 Data blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 ...