AMMC-5024-W10 Avago Technologies US Inc., AMMC-5024-W10 Datasheet - Page 9

• Manufacturer Part Number: AMMC-5024-W10
• Description: IC MMIC AMP TWA GAAS 30-40GHZ
• Manufacturer: Avago Technologies US Inc.
• Type: General Purposer

Specifications of AMMC-5024-W10

• Function: Amplifier
• Noise Figure Typ: 5.5dB
• Supply Current: 350mA
• Supply Voltage Range: 7V
• Frequency Max: 40GHz
• Frequency Min: 30kHz
• Supply Voltage Max: 10V
• Gain: 16dB
• Number Of Channels: 1
• Frequency (max): 40GHz
• Output Power: 22.5@22000MHzdBm
• Power Supply Requirement: Single
• Single Supply Voltage (max): 10V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1845; AMMC-5024-W10

Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip
applications the chip should be attached directly to the
ground plane (e.g. circuit carrier or heatsink) using electri-
cally conductive epoxy
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plated
metal shim (same length as the MMIC) under the chip
which is of correct thickness to make the chip and adja-
cent circuit the same height. The amount of epoxy used
for the chip or shim attachment should be just enough to
provide a thin fillet around the bottom perimeter of the
chip. The ground plane should be free of any residue that
may jeopardize electrical or mechanical attachment.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is normally suf-
ficient for single connections, however double bonding
with 0.7mil gold wire will reduce series inductance. Gold
thermo-sonic wedge bonding is the preferred method
Drain Bias
(Vdd)
Vdd AUX
RF_Input
Figure 19. AMMC-5024 Schematic.
9
[1,2]
Nine Identical
.
GND
for wire attachment to the bond pads. The recommended
wire bond stage temperature is 150°c ± 2°c.
Caution should be taken to not exceed the Absolute Maxi-
mum Rating for assembly temperature and time.
The chip is 100um thick and should be handled with care.
This MMIC has exposed air bridges on the top surface and
should be handled by the edges or with a custom collet
(do not pick up the die with a vacuum on die center).
Bonding pads and chip backside metallization are gold.
This MMIC is also static sensitive and ESD precautions
should be taken. Eutectic attach is not recommended and
may jeopardize reliability of the device.
For more detailed information see Avago Technologies’
Application Note #5359 “GaAs MMIC assembly and han-
dling guidelines”.
Notes:
1. Ablebond 84-1 LMl silver epoxy is recommended
2. Eutectic attach is not recommended and may jeopardize reliability
of the device
Second Gate
First Gate
Bias (Vg1)
RF_Output
DET_OUT
DET_REF
DET_BIAS