LT5506EUF Linear Technology, LT5506EUF Datasheet - Page 12
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LT5506EUF
Manufacturer Part Number
LT5506EUF
Description
IC DEMOD QUADRATURE VGA 16QFN
Manufacturer
Linear Technology
Datasheet
1.LT5506EUF.pdf
(12 pages)
Specifications of LT5506EUF
Function
Demodulator
Lo Frequency
80MHz ~ 1GHz
Rf Frequency
40MHz ~ 500MHz
Gain
59dB
Noise Figure
6.8dB
Current - Supply
36mA
Voltage - Supply
1.8 V ~ 5.25 V
Package / Case
16-QFN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
P1db
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LT5506EUF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LT5506EUF#PBF
Manufacturer:
LT
Quantity:
3 360
Part Number:
LT5506EUF#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LT5506EUF#TRPBF
Manufacturer:
ST
Quantity:
10 439
Part Number:
LT5506EUF#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
APPLICATIO S I FOR ATIO
PACKAGE DESCRIPTIO
LT5506
PART NUMBER DESCRIPTION
LT5500
LT5502
LT5503
LT5504
LTC5505
LTC5507
LT5511
LT5512
12
RELATED PARTS
4.35 0.05
2.90 0.05
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
2.15 0.05
(4 SIDES)
1.8GHz to 2.7GHz Receiver Front End
400MHz Quadrature IF Demodulator with RSSI
1.2GHz to 2.7GHz Direct IQ Modulator and Mixer 1.8V to 5.25V Supply, Four Step RF Power Control, 120MHz Modulation Bandwidth
800MHz to 2.7GHz RF Measuring Receiver
RF Power Detectors with >40dB Dynamic Range 2.7V to 6V Supply, 300MHz to 3.5GHz, Temperature Compensated
100kHz to 1000MHz RF Power Detector
High Signal Level Upconverting Mixer
High Signal Level Downconverting Mixer
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
U
2.4GHz TO 2.5GHz
SYNTHESIZER
SYNTHESIZER
FRONT END
RX INPUT:
MAIN
AUX
RX
U
1ST LO,
2.12GHz
TO 2.22GHz
Figure 11. 2.4GHz to 2.5GHz Receiver Application (RX IF = 280MHz)
IF SAW BP FILTER
2ND LO,
560MHz
–10dBm
280MHz
W
0.65 BSC
U
3.3pF
3.3pF
0.30 0.05
15nH
15nH
10pF
www.linear.com
0.72 0.05
39nH
PACKAGE
OUTLINE
16-Lead Plastic QFN (4mm 4mm)
11
10
3
(Reference LTC DWG # 05-08-1692)
U
2
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
VGA
COMMENTS
1.8V to 5.25V Supply, Dual-Gain LNA, Mixer
1.8V to 5.25V Supply, 70MHz to 400MHz IF, 84dBm Limiting Gain, 90dB RSSI Range
2.7V to 5.25V Supply, 80dB Dynamic Range, Temperature Compensated
2.7V to 6V Supply, 40dB Dynamic Range, Temperature Compensated
RF Output to 3GHz, 17dBm IIP3, Integrated LO Buffer
DC-3GHz, 21dBm IIP3, Integrated LO Buffer
PIN 1
TOP MARK
UF Package
1 F
f/2
4.00 0.10
(4 SIDES)
1nF
Q-MIXER
V
I-MIXER
CC
5, 8
0
90
0,1,4
CLIPPER
1.8V
CLIPPER LPF
HARD
HARD
LT5506
LPF
0.75 0.05
16
15
7
6
14
13
12
9
I-OUTPUTS
IF DET
V
Q-OUTPUTS
CTRL
2.15 0.10
0.200 REF
0.00 – 0.05
(4-SIDES)
PROCESSOR
STBY
EN
BASEBAND
LINEAR TECHNOLOGY CORPORATION 2002
A/D
A/D
D/A
A/D
LT/TP 1003 1K REV A • PRINTED IN USA
R = 0.115
5506 F11
BOTTOM VIEW—EXPOSED PAD
TYP
15
16
0.65 BSC
0.30 0.05
0.55 0.20
1
2
(UF) QFN 0503
5506fa