MGA-81563-TR1 Avago Technologies US Inc., MGA-81563-TR1 Datasheet - Page 2

• Manufacturer Part Number: MGA-81563-TR1
• Description: IC AMP MMIC GAAS 3V SOT-363
• Manufacturer: Avago Technologies US Inc.

Specifications of MGA-81563-TR1

• Current - Supply: 51mA
• Frequency: 100MHz ~ 6GHz
• Gain: 12.4dB
• Noise Figure: 2.8dB
• P1db: 14.8dBm
• Package / Case: SC-70-6, SC-88, SOT-363
• Rf Type: PCS, PHS, ISM, SATCOM, WLL
• Test Frequency: 2GHz
• Voltage - Supply: 2.7V ~ 3.3V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 516-1510-2

2
MGA-81563 Absolute Maximum Ratings
MGA-81563 Electrical Specifications, TC = 25°C, ZO = 50 Ω, Vd = 3 V
Notes:
1. Guaranteed specifications are 100% tested in the circuit in Figure 10 in the Applications Information section.
2. Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during the initial characterization
Symbol
Gtest
NFtest
NF50
|S21|2
P
IP
VSWR
VSWR
I
d
1 dB
3
of this product, and is intended to be used as an estimate for distribution of the typical specification.
Symbol
T
V
out
in
V
P
T
V
STG
ch
gd
in
in
d
Parameters and Test Conditions
Gain in test circuit
Noise Figure in test circuit
Noise Figure in 50 Ω system
Gain in 50 Ω system
Output Power at 1 dB Gain Compression
Output Third Order Intercept Point
Input VSWR
Output VSWR
Device Current
Device Voltage, RF Output
to Ground
Device Voltage, Gate
to Drain
Range of RF Input Voltage
to Ground
CW RF Input Power
Channel Temperature
Storage Temperature
Parameter
[1]
[1]
Units
dBm
°C
°C
V
V
V
f = 2.0 GHz
f = 2.0 GHz
f = 0.5 GHz
f = 1.0 GHz
f = 2.0 GHz
f = 3.0 GHz
f = 4.0 GHz
f = 6.0 GHz
f = 0.5 GHz
f = 1.0 GHz
f = 2.0 GHz
f = 4.0 GHz
f = 6.0 GHz
f = 0.5 GHz
f = 1.0 GHz
f = 2.0 GHz
f = 3.0 GHz
f = 4.0 GHz
f = 6.0 GHz
f = 2.0 GHz
f = 2.0 GHz
f = 2.0 GHz
= 3.0 GHz
+0.5 to -1.0
Maximum
-65 to 150
Absolute
+13
-6.0
165
6.0
[1]
Units
dB
dB
dBm
dBm
mA
Notes:
1. Permanent damage may occur if any of
2. T
Min.
10.5
31
these limits are exceeded.
temperature at the package pins where
contact is made to the circuit board.)
C
= 25°C (T
Thermal Resistance
T
Typ.
12.4
2.8
3.1
3.0
2.7
2.7
2.8
3.5
12.5
12.5
12.3
11.8
11.4
10.2
15.1
14.8
14.8
14.8
14.8
14.7
+27
2.7:1
2.0:1
42
ch-c
C
= 220°C/W
is defined to be the
Max.
14.5
3.8
51
[2]
0.44
0.21
0.21
0.44
0.86
1.0
:
Std Dev
[2]