BLM6G22-30G,135 NXP Semiconductors, BLM6G22-30G,135 Datasheet
BLM6G22-30G,135
Specifications of BLM6G22-30G,135
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BLM6G22-30G,135 Summary of contents
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... BLM6G22-30; BLM6G22-30G W-CDMA 2100 MHz to 2200 MHz power MMIC Rev. 4 — 7 March 2011 1. Product profile 1.1 General description 30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 2100 MHz to 2200 MHz. Available in gull wing for surface mount (SOT822-1) or flat lead (SOT834-1) ...
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... Pinning information 2.1 Pinning Fig 1. 2.2 Pin description Table 2. Symbol GND V DS1 n.c. RF_INPUT V GS1 V GS2 RF_OUT/V RF_GND 3. Ordering information Table 3. Type number BLM6G22-30 BLM6G22-30G BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G BLM6G22-30 BLM6G22-30G GND DS1 n. n.c. 5 n.c. 6 RF_INPUT 7 n. GS1 10 ...
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... V DS1 6 RF_INPUT 9 V GS1 TEMPERATURE 10 COMPENSATED BIAS V GS2 Block diagram of BLM6G22-30 and BLM6G22-30G Limiting values Parameter drain-source voltage gate-source voltage first stage drain current second stage drain current storage temperature junction temperature Thermal characteristics Parameter first stage thermal resistance from junction to case ...
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... Symbol η D IMD3 ACPR 8. Application information 8.1 Ruggedness The BLM6G22-30 and BLM6G22-30G are capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions 8.2 Impedance information Table 7. f MHz 2075 2085 2095 2105 ...
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... NXP Semiconductors 8.3 Performance curves Performance curves are measured in a BLM6G22-30G application circuit (dB η 2050 2100 2150 = 25 ° case 280 mA; carrier spacing = 10 MHz. Dq2 Fig 3. 2-carrier W-CDMA power gain and drain efficiency as functions of frequency; typical values ( η ( (1), (2), (3) 24 − 270 mA; I ...
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... Test signal: IS-95 with pilot, paging, sync and 6 traffic channels (Walsh codes 8 to 13). PAR = 9 0.01 % probability on the CCDF. = −30 °C (1) T case = 25 °C (2) T case = 85 °C (3) T case Fig 9. Single-carrier peak output power as function of frequency and temperature; typical values BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G 001aah626 IMD (dBc) ( 280 mA. Dq2 Fig 8. 35 ...
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... Component C1, C13 C2, C4, C8, C11, C12 multilayer ceramic chip capacitor 4.7 μ C3, C15 C5, C9, C10, C14 C6 [1] American Technical Ceramics (ATC) type 100A or capacitor of same quality. BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G C10 List of components Figure 10. Description multilayer ceramic chip capacitor 0.3 pF ...
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... Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. Outline version IEC SOT834-1 Fig 11. Package outline SOT834-1 (HSOP16F) BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G (2× (5×) (2× (10× ...
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... Unit max 0.2 3.5 mm nom 3.6 0.35 min 0 3.2 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included Outline version IEC SOT822-1 Fig 12. Package outline SOT822-1 (HSOP16) BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G (2× (2×) b (5× (10× scale ...
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... IS-95 LDMOS MMIC PA PAR PDPCH RF VSWR W-CDMA BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G ESD protection characteristics Moisture sensitivity level Abbreviations Description Third Generation Partnership Project Complementary Cumulative Distribution Function Continuous Wave Dedicated Physical CHannel Interim Standard 95 Laterally Diffused Metal-Oxide Semiconductor Monolithic Microwave Integrated Circuit ...
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... NXP Semiconductors 13. Revision history Table 12. Revision history Document ID BLM6G22-30_BLM6G22-30G v.4 20110307 Modifications: BLM6G22-30_BLM6G22-30G v.3 20081121 BLM6G22-30_BLM6G22-30G v.2 20080904 BLM6G22-30_BLM6G22-30G v.1 20080303 BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G Release date Data sheet status Product data sheet • Data sheet status has been changed to “Product data sheet” ...
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... BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G W-CDMA 2100 MHz to 2200 MHz power MMIC [3] Definition This document contains data from the objective specification for product development. ...
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... For more information, please visit: For sales office addresses, please send an email to: BLM6G22-30_BLM6G22-30G Product data sheet BLM6G22-30; BLM6G22-30G W-CDMA 2100 MHz to 2200 MHz power MMIC NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BLM6G22-30_BLM6G22-30G All rights reserved. Date of release: 7 March 2011 ...