WS2512-BLK Avago Technologies US Inc., WS2512-BLK Datasheet - Page 13

• Manufacturer Part Number: WS2512-BLK
• Description: MODULE PA UMTS2100 4X4MM 10-PIN
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of WS2512-BLK

• Package / Case: 10-DFN
• Current - Supply: 465mA ~ 510mA
• Frequency: 1.92GHz ~ 1.98GHz
• Gain: 23.5dB ~ 26.5dB
• Rf Type: W-CDMA, HSPDA
• Voltage - Supply: 3.2V ~ 4.2V
• Operating Frequency: 1980 MHz
• Operating Supply Voltage: 4.2 V
• Supply Current: 510 mA
• Maximum Operating Temperature: + 90 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 20 C
• Number Of Channels: 1 Channel
• Frequency (max): 1.98GHz
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3.2V
• Single Supply Voltage (typ): 3.4V
• Single Supply Voltage (max): 4.2V
• Package Type: SMD
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temperature Classification: Commercial
• Operating Temp Range: -20C to 90C
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

13
PCB Design Guidelines
The recommended WS2512 PCB
Land pattern is shown in Figure
25 and Figure 26. The substrate
is coated with solder mask
between the I/O and conductive
paddle to protect the gold pads
from short circuit that is caused
by solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder
screen or stencil is required to
ensure optimum amount of
solder paste is deposited onto
the PCB pads.
The recommended stencil layout
is shown in Figure 27. Reducing
the stencil opening can poten-
tially generate more voids. On the
other hand, stencil openings
larger than 100% will lead to
excessive solder paste smear or
bridging across the I/O pads or
conductive paddle to adjacent
I/O pads. Considering the fact
that solder paste thickness will
directly affect the quality of the
solder joint, a good choice is to
use laser cut stencil composed of
0.100 mm (4mils) or 0.127 mm
(5mils) thick stainless steel
which is capable of
producing the required fine
stencil outline.
Figure 25. Metallization.
0.85
Figure 26. Solder Mask Opening.
Figure 27. Solder Paste Stencil Aperature.
0.85
0.85
0.5
0.4
0.4
0.25
0.7
0.8
0.7
2.0
0.1
1.6
0.8 x 0.5
0.8 x 0.6
on 0.6mm pitch
Ø 0.3mm
0.6
0.65
0.6
0.6
1.8
1.6