MMG3014NT1 Freescale Semiconductor, MMG3014NT1 Datasheet
MMG3014NT1
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MMG3014NT1 Summary of contents
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... Heterojunction Bipolar Transistor Technology (InGaP HBT) Broadband High Linearity Amplifier The MMG3014NT1 is a General Purpose Amplifier that is internally input matched and internally output prematched designed for a broad range of Class A, small - signal, high linearity, general purpose applica- tions suitable for applications with frequencies from 40 to 4000 MHz such as Cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small - signal RF ...
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... Output Return Loss (S22) Power Output @ 1dB Compression Third Order Output Intercept Point Noise Figure (1) Supply Current (1) Supply Voltage 1. For reliable operation, the junction temperature should not exceed 150°C. MMG3014NT1 Vdc, 900 MHz 25°C, 50 ohm system, in Freescale Application Circuit Symbol G p ...
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... Machine Model (per EIA/JESD 22 - A115) Charge Device Model (per JESD 22 - C101) Table 7. Moisture Sensitivity Level Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 RF Device Data Freescale Semiconductor Figure 1. Functional Diagram Class 1C (Minimum) A (Minimum) IV (Minimum) Rating Package Peak Temperature 1 260 Unit °C MMG3014NT1 3 ...
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... OUTPUT POWER (dBm) out Figure 4. Small - Signal Gain versus Output Power 200 180 160 140 120 100 COLLECTOR VOLTAGE (V) CC Figure 6. Collector Current versus Collector Voltage MMG3014NT1 4 50 OHM TYPICAL CHARACTERISTICS 0 −5 25°C − Figure 3. Input/Output Return Loss versus Vdc 135 0.5 42 ...
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... Figure 13. Single - Carrier W - CDMA Adjacent Channel Power Ratio versus Output Power Vdc 900 MHz 1 MHz Tone Spacing − TEMPERATURE (_C) versus Case Temperature 125 130 135 140 145 T , JUNCTION TEMPERATURE (° Vdc 135 Vdc 135 mA 2140 MHz OUTPUT POWER (dBm) out MMG3014NT1 80 100 150 25 5 ...
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... C1, C2 220 pF Chip Capacitors C3 0.1 μF Chip Capacitor C4 2.2 μF Chip Capacitor C5 0.2 pF Chip Capacitor C6 4.7 pF Chip Capacitor C7 1.8 pF Chip Capacitor Chip Inductor R1 0 Ω Chip Resistor MMG3014NT1 6 V SUPPLY R1 L1 DUT 0.172″ x 0.058″ Microstrip Z6 0.403″ x 0.058″ Microstrip PCB Getek Grade ML200C, 0.031″ ...
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... Getek Grade ML200C, 0.031″, ε Figure 17. 50 Ohm Test Circuit Schematic C1 S11 S22 2200 2400 Figure 19. 50 Ohm Test Circuit Component Layout Description OUTPUT 4 MMG30XX Rev 2 Part Number Manufacturer C0805C220J5GAC Kemet C0603C104J5RAC Kemet C0805C225J4RAC Kemet C0603C159J5RAC Kemet C0603C119J5GAC Kemet HK160815NJ- T Taiyo Yuden ERJ3GEY0R00V Panasonic MMG3014NT1 7 ...
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... Table 10. 50 Ohm Test Circuit Component Designations and Values Part C1 Chip Capacitors C3 0.1 μF Chip Capacitor C4 2.2 μF Chip Capacitor C5, C6 1.1 pF Chip Capacitors Chip Inductor R1 0 Ω Chip Resistor MMG3014NT1 8 DUT 0.036″ x 0.058″ Microstrip Z6 0.403″ x 0.058″ Microstrip PCB Getek Grade ML200C, 0.031″ ...
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... Figure 23. 50 Ohm Test Circuit Schematic C1 3550 3600 Figure 25. 50 Ohm Test Circuit Component Layout Description V SUPPLY OUTPUT 4 MMG30XX Rev 2 Part Number Manufacturer C0805C339J5GAC Kemet C0805C209J5GAC Kemet C0603C104J5RAC Kemet C0805C225J4RAC Kemet 06035J0R6BS AVX 06035J0R9BS AVX 06035J0R8BS AVX HK160856NJ- T Taiyo Yuden ERJ3GEY0R00V Panasonic MMG3014NT1 9 ...
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... MMG3014NT1 10 50 OHM TYPICAL CHARACTERISTICS ( Vdc 135 mA 25°C, 50 Ohm System ∠ φ 10.280 153.8 0.0336 10.107 148.3 ...
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... Recommended Solder Stencil Figure 26. Recommended Mounting Configuration MMG3014NT1 12 7.62 1.27 NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN ...
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... RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS MMG3014NT1 13 ...
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... MMG3014NT1 14 RF Device Data Freescale Semiconductor ...
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... RF Device Data Freescale Semiconductor MMG3014NT1 15 ...
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... Sept. 2008 • Updated Fig. 15, “S21, S11 and S22 versus Frequency”, to correct S11 and S22 curve label transposition error • Updated data in Table 12, “Common Emitter S-Parameters”, for better simulation response and 11 MMG3014NT1 16 PRODUCT DOCUMENTATION REVISION HISTORY Description RF Device Data ...
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... Denver, Colorado 80217 1 - 800- 441- 2447 303- 675- 2140 Fax 303- 675- 2150 LDCForFreescaleSemiconductor@hibbertgroup.com RF Device Data Document Number: MMG3014NT1 Rev. 1, 9/2008 Freescale Semiconductor Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...