MGA-82563-TR1G Avago Technologies US Inc., MGA-82563-TR1G Datasheet - Page 6

• Manufacturer Part Number: MGA-82563-TR1G
• Description: IC AMP MMIC GAAS 3V SOT-363
• Manufacturer: Avago Technologies US Inc.
• Type: General Purpose Amplifierr

Specifications of MGA-82563-TR1G

• P1db: 17.3dBm
• Noise Figure: 2.2dB
• Package / Case: SC-70-6, SC-88, SOT-363
• Current - Supply: 63mA ~ 101mA
• Frequency: 100MHz ~ 6GHz
• Gain: 12dB ~ 15dB
• Rf Type: ISM, PHS, PCS, SATCOM, WLL
• Test Frequency: 2GHz
• Voltage - Supply: 2.7V ~ 3.3V
• Mounting Style: SMD/SMT
• Technology: MMIC Amplifier
• Number Of Channels: 1
• Operating Frequency: 6000 MHz
• Operating Supply Voltage: 3 V
• Supply Current: 101 mA @ 3 V
• Manufacturer's Type: MMIC Amplifier
• Frequency (max): 6GHz
• Operating Supply Voltage (typ): 3V
• Package Type: SOT-363
• Mounting: Surface Mount
• Pin Count: 6
• Noise Figure (typ): 2.7@6000MHzdB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1587-2

Figure 12. Normal Distribution.
RF Layout
The RF layout in Figure 13 is suggested as a starting point
for microstripline designs using the MGA-82563 ampli-
fier. Adequate grounding is needed to obtain optimum
per formance and to maintain stability. All of the ground
pins of the MMIC should be connected to the RF ground-
plane on the backside of the PCB by means of plated
through holes (vias) that are placed near the package
terminals. As a minimum, one via should be located next
to each ground pin to ensure good RF grounding. It is a
good practice to use multiple vias to further minimize
ground path inductance.
Figure 13. RF Layout.
In addition to the RF considerations, the use of multiple
vias for grounding is important for the purpose of pro-
viding a lower resistance thermal path to the heatsink.
It is recommended that the PCB pads for the ground pins
not be connected together underneath the body of the
package. PCB traces hidden under the package cannot
be adequately inspected for SMT solder quality.
Standard statistics tables or calculations provide the
probability of a parameter falling between any two
values, usually symmetrically located about the mean.
Referring to Figure 12 for example, the probability of a
parameter being between ±1V is 68.3%; between ±2V is
95.4%; and between ±3V is 99.7%.
6
RF Input
50 Ω
-3σ
-2σ
-1σ
Parameter Value
82
68%
95%
99%
Mean (μ)
(typical)
+1σ +2σ +3σ
RF Output
50 Ω
and V
d
PCB Material
FR-4 or G-10 printed circuit board materials are a good
choice for most low cost wireless applications. Typical
board thickness is 0.020 to 0.031 inches. The width of the
50 Ω microstriplines on PC boards in this thickness range
is also very convenient for mounting chip components
such as the series inductor at the input or DC blocking
and bypass capacitors.
For higher frequencies or for noise figure critical appli-
cations, the additional cost of PTFE/glass dielectric ma-
terials may be warranted to minimize transmission line
loss at the amplifier’s input. A 0.5 inch length of 50 Ω
microstripline on FR-4, for example, has approximately
0.3 dB loss at 4 GHz. This loss will add directly to the
noise figure of the MGA-82563.
Biasing
The MGA-82563 is a voltage-biased device and is
designed to operate from a single, +3 volt power supply
with a typical current drain of 84 mA. The internal cur-
rent regulation circuit allows the amplifier to be operat-
ed with voltages as low as +1.5 volts. Refer to the section
titled “Operation at Bias Voltages Other than 3 Volts” for
information on performance and precau tions when us-
ing other voltages.
Typical Application Example
The printed circuit layout in Figure 14 can serve as a de-
sign guide. This layout is a microstripline design (solid
groundplane on the backside of the circuit board) with a
50 Ω input and output. The circuit is fabricated on 0.031-
inch thick FR-4 dielectric material. Plated through holes
(vias) are used to bring the ground to the top side of the
circuit where needed. Multiple vias are used to reduce
the inductance of the paths to ground.
Figure 14. PCB Layout.
MGA-8-A
IN
OUT
+V