BGM1013,115 NXP Semiconductors, BGM1013,115 Datasheet - Page 4

• Manufacturer Part Number: BGM1013,115
• Description: MMIC AMPLIFIER SOT-363
• Manufacturer: NXP Semiconductors
• Type: MMIC Wideband Amplifierr

Specifications of BGM1013,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Current - Supply: 27.5mA
• Frequency: 0Hz ~ 2.2GHz
• Gain: 3.62dB
• Noise Figure: 4.6dB ~ 4.7dB
• P1db: 14dBm
• Rf Type: ISM
• Test Frequency: 1GHz
• Voltage - Supply: 5V ~ 6V
• Supply Voltage (max): 6 V
• Supply Current: 35 mA
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Manufacturer's Type: Broadband Amplifier
• Number Of Channels: 1
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Package Type: SOT-363
• Mounting: Surface Mount
• Pin Count: 6
• Noise Figure (typ): 4.9@2200MHzdB
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2076-2; 934058247115; BGM1013 T/R

Philips Semiconductors
Table 8:
V
9. Application information
BGM1013_4
Product data sheet
Symbol Parameter
P
IP3
IP3
IM2
S
L(1dB)
= 5 V; I
in
out
S
load power at 1 dB gain
compression
input third order intercept point
output third order intercept point f = 1 GHz
second order intermodulation
product
Characteristics
= 27.5 mA; T
Figure 1
internally matched to 50
impedance is also very good to 75
capacitors C1 and C2 should be not more than 100 pF for applications above 100 MHz.
Their values can be used to fine-tune the input and output impedance.
For the RF-choke, optimal results are obtained with a good quality chip inductor like the
TDK MLG1608 (0603) or a wire-wound SMD. The value of the inductor can be used to
fine-tune the output impedance.
The RF choke and supply decoupling components should be located as close as possible
to the MMIC.
Ground paths must be as short as possible. The printed-circuit board (PCB) top ground
plane must be as close as possible to the MMIC, and ideally directly beneath it. When
using vias, use at least 3 vias for the top ground plane in order to limit ground path
inductance. Supply decoupling with C3 should be from pin 1 to the same top ground
plane.
j
= 25 C; measured on demo board; unless otherwise specified.
Fig 1. Typical application circuit
…continued
(1) R1 is omitted in typical application.
shows a typical application circuit for the BGM1013 MMIC. The device is
Conditions
f = 1 GHz
f = 2.2 GHz
f = 1 GHz
f = 2.2 GHz
f = 2.2 GHz
f
f
0
0
= 1 GHz; P
= 1 GHz; P
RF in
Rev. 04 — 1 May 2006
C1
and therefore does not need any external matching. Output
IN
D
D
6
= 45 dBm (P
= 40 dBm (P
GND1
BGM1013
4
SOT363
load. The value of the input and output DC blocking
1
V
GND2
S
2, 5
L
L
3
= 10 dBm)
= 5 dBm)
OUT
L1
C2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
001aab389
R1 (1)
C3
Min
12.0
7.0
21
17
-
-
MMIC wideband amplifier
14
15
V
RF out
S
BGM1013
Typ
13.0
8.1
22.7
18.6
45
43
12.8
13.2
Max
-
-
-
-
-
-
43
41
4 of 14
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBc
dBc