STEVAL-TDR004V1 STMicroelectronics, STEVAL-TDR004V1 Datasheet - Page 9

• Manufacturer Part Number: STEVAL-TDR004V1
• Description: BOARD REF DESIGN RF DMOS PWR AMP
• Manufacturer: STMicroelectronics
• Type: Power Amplifierr

Specifications of STEVAL-TDR004V1

• Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6240

STEVAL-TDR004V1
6
6.1
6.2
SD2933 mounting recommendations
Mounting recommendations
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Mounting sequence
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Ensure the holes in the heat sinks are free from burrs
The minimum depth of tapped holes in heat sinks is 6 mm
Use 4-40 UNC-2A cheese-head screws with a flat washer to more evenly distribute the
joint pressure
The minimum flatness of the mounting area is 0.02 mm
Mounting area roughness should be less than 0.5 µm (micro)
Avoid, as much as possible, the use of flux or flux solutions, as they can penetrate even
hermetically sealed ceramic-capped transistors. Tin and wash the printed circuit board
BEFORE mounting the power transistors, then solder the transistor leads without using
flux
Transistor leads may be tinned by dipping them full-length into a solder bath at a
temperature of about 230 °C. No flux should be used during tinning
Recommended heat sink compounds: WPSII (silicon-free) from Austerlitz Electronics,
340 from Dow Corning, etc.
Apply a thin layer of evenly distributed heat sink compound to the flange
Position the device with flat washers in place
Tighten the screws until finger tight (0.05 Nm)
Further tighten the screws until the specified torque is reached
For M174, M177 & M244 package types, torque should be a minimum of 0.6 Nm, and a
maximum of 0.75 Nm.
Doc ID 14981 Rev 2
SD2933 mounting recommendations
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