TWR-S08MM128 Freescale Semiconductor, TWR-S08MM128 Datasheet - Page 2
TWR-S08MM128
Manufacturer Part Number
TWR-S08MM128
Description
TOWER SYSTEM BOARD MC9S08MM128
Manufacturer
Freescale Semiconductor
Series
ColdFire®, Flexis™r
Type
MCUr
Datasheets
1.TWR-S08MM128.pdf
(12 pages)
2.TWR-S08MM128.pdf
(13 pages)
3.MC9S08MM128CMB.pdf
(52 pages)
Specifications of TWR-S08MM128
Contents
Board
Processor To Be Evaluated
9S08MM128
Data Bus Width
8 bit
Interface Type
USB, CAN
Silicon Manufacturer
Freescale
Core Architecture
Coldfire, HCS08
Core Sub-architecture
Coldfire V1, HCS08
Silicon Core Number
MCF51, MC9S08
Silicon Family Name
Flexis - MCF51MM, Flexis - S08MM
Rohs Compliant
Yes
For Use With/related Products
Freescale Tower System, MC9S08MM128
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
1 Overview ...................................................................................................................................................... 3
2 Reference Documents . ............................................................................................................................. 4
3 H
4 Jumper Table .............................................................................................................................................. 8
5 Input/Output Connectors and Pin Usage Table . .......................................................................... 10
6 O
7 Bootloader Mode For MC9S08MM128 ............................................................................................ 11
8 BDM inteface (Optional) ...................................................................................................................... 12
3.1 Clocking .................................................................................................................................................................................. 4
3.2 System Power . ...................................................................................................................................................................... 4
3.3 Debug Interface ................................................................................................................................................................... 4
3.4 RS232 Interface ................................................................................................................................................................... 5
3.5 Infrared Port ......................................................................................................................................................................... 5
3.6 Medical Connector . ............................................................................................................................................................. 5
3.7 Elevator Connections ........................................................................................................................................................ 6
3.8 Mechanical Form Factor .................................................................................................................................................. 8
6.1 Bootloader Mode For MC9S08JM60 ........................................................................................................................ 11
ardware Features . .................................................................................................................................. 4
SBDM . ....................................................................................................................................................... 11
TWR‐MC9S08MM128 User Manual
Contents
Page 2 of 13