DSP56311VF150 Freescale Semiconductor, DSP56311VF150 Datasheet - Page 71

• Manufacturer Part Number: DSP56311VF150
• Description: IC DSP 24BIT 150MHZ 196-BGA
• Manufacturer: Freescale Semiconductor
• Series: DSP563xxr
• Type: Fixed Pointr

Specifications of DSP56311VF150

• Interface: Host Interface, SSI, SCI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (576 B)
• On-chip Ram: 384kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.80V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 196-MAPBGA
• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 384KB
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (min): 1.7/1.7/3/3/3/3/3/3V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Package: 196MA-BGA
• Numeric And Arithmetic Format: Fixed-Point
• Maximum Speed: 150 MHz
• Device Million Instructions Per Second: 150 MIPS
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Design Considerations
This section describes various areas to consider when incorporating the DSP56311 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, T
Where:
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Where:
R
the case-to-ambient thermal resistance, R
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from R
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
Freescale Semiconductor
θJC
T
R
P
R
R
R
A
D
is device-related and cannot be influenced by the user. The user controls the thermal environment to change
θJA
θJA
θJC
θCA
Equation 1:
Equation 2:
=
=
=
=
=
=
T
R
J
θJA
=
T
=
A
R
+
ambient temperature °C
package junction-to-ambient thermal resistance °C/W
power dissipation in package
package junction-to-ambient thermal resistance °C/W
package junction-to-case thermal resistance °C/W
package case-to-ambient thermal resistance °C/W
θJC
(
P
D
+
×
R
R
θCA
θCA
θJ A
DSP56311 Technical Data, Rev. 8
)
. For example, the user can change the air flow around the device, add
J
, in ° C can be obtained from this equation:
θJA
do not satisfactorily answer whether the thermal
4
4-1