PCF2120U/10AA/1,00 NXP Semiconductors, PCF2120U/10AA/1,00 Datasheet
PCF2120U/10AA/1,00
Specifications of PCF2120U/10AA/1,00
Related parts for PCF2120U/10AA/1,00
PCF2120U/10AA/1,00 Summary of contents
Page 1
PCF2120 Quartz oscillator Rev. 01 — 5 February 2008 1. General description The PCF2120 is a CMOS quartz oscillator optimized for low power consumption. The 32 kHz output signal is gated using an enable signal. 2. Features I Clock operating ...
Page 2
... NXP Semiconductors 5. Ordering information Table 2. Type number PCF2120TK PCF2120U [1] Packing method: sawn wafer on Film Frame Carrier (FFC). 6. Block diagram Fig 1. Block diagram 7. Pinning information 7.1 Pinning terminal 1 index area OSCI OSCO Fig 2. PCF2120_1 Product data sheet Ordering information Package Name Description ...
Page 3
... NXP Semiconductors 7.2 Pin description Table 3. Symbol n.c. OSCI OSCO n. n.c. TEST CLKOUT V DD CLKOE 8. Functional description The 32 kHz quartz oscillator is optimized for directly connecting kHz tuning fork quartz crystal. No additional tuning capacitors are required. Laser tuning of the quartz or quartz selection for matching is used to tune the oscillator if required. ...
Page 4
... NXP Semiconductors 9. Internal circuitry Fig 5. 10. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg V esd I lu [1] Human Body Model (HBM) according to JESD22-A114. [2] Machine Model (MM) according to JESD22-A115. [3] Charged-Device Model (CDM) according to JESD22-C101. [4] Latch-up testing according to JESD78. ...
Page 5
... NXP Semiconductors 11. Static characteristics Table 5. Static characteristics specified. Symbol Parameter Supply V supply voltage DD I supply current DD Inputs Pin OSCI V input voltage I Pin CLKOE V input voltage I V LOW-level input voltage IL V HIGH-level input voltage IH I input leakage current LI Outputs Pin OSCO ...
Page 6
... NXP Semiconductors [2] Pin CLKOUT is loaded with a 7.5 pF capacitor. When pin CLKOUT is enabled the current consumption is a function of the load on that pin, the output frequency and the supply voltage. The additional current consumption for a given load can be calculated from the formula I Where: ...
Page 7
... NXP Semiconductors Fig 7. Supply current as a function of ambient temperature 13. Application information You can mount the PCF2120 oscillator together with the quartz crystal as an accurate and pre-tuned quartz oscillator in one package. (1) Do not connect pin TEST chip-internally connected. Fig 8. PCF2120_1 Product data sheet 1 ...
Page 8
... NXP Semiconductors 14. Package outline HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
Page 9
... NXP Semiconductors 15. Bare die outline Wire bond die; 7 bonding pads; 0.57 x 1 DIMENSIONS (mm are the original dimensions) UNIT 0.212 mm 1.1 0.57 0.07 0.188 OUTLINE VERSION IEC PCF2120U Fig 10. Bare die outline PCF2120U Table 7. Values x and Pad 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
Page 10
... NXP Semiconductors 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board ...
Page 11
... NXP Semiconductors • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) ...
Page 12
... NXP Semiconductors For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Revision history Table 10. Revision history Document ID Release date PCF2120_1 20080205 PCF2120_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 5 February 2008 ...
Page 13
... Bare die — All die are tested on compliance with all related technical specifications as stated in this data sheet up to the point of wafer sawing for a period of ninety (90) days from the date of delivery by NXP Semiconductors. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet ...
Page 14
... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Internal circuitry Limiting values Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 13 Application information Package outline ...