C5750X7R1H225KT5 TDK Corporation, C5750X7R1H225KT5 Datasheet - Page 14

• Manufacturer Part Number: C5750X7R1H225KT5
• Description: CAP CER 2.2UF 50V X7R 10% 2220
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C5750X7R1H225KT5

• Capacitance: 2.2µF
• Voltage - Rated: 50V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 2220 (5750 Metric)
• Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm)
• Thickness: 1.60mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-6121-2

Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — Open Mode Design // Version A11
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
[CC0805]
[CC0805]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C2012
C3225
Chip capacitor
A
[CC1206]
[CC1206]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
Unit: mm
C3216
C4532
Solder land
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C5750
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
C Series — Open Mode Design
Peak
Temp
• Recommended Soldering Profile
Solder
0
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Manual
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
△T
Wave Soldering
Temp./
Dura.
Peak Temp time
Soldering
C2012(CC0805), C3216(CC1206)
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
300
0
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
(sec.)
3sec. (As short as possible)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling