CU4032K250G2 EPCOS Inc, CU4032K250G2 Datasheet - Page 27

VARISTOR STD 250VRMS 4032 SMD

CU4032K250G2

Manufacturer Part Number
CU4032K250G2
Description
VARISTOR STD 250VRMS 4032 SMD
Manufacturer
EPCOS Inc
Series
CUr
Datasheet

Specifications of CU4032K250G2

Varistor Voltage
390V
Current-surge
1.2kA
Number Of Circuits
1
Maximum Ac Volts
250VAC
Maximum Dc Volts
320VDC
Energy
19J
Package / Case
Non-Standard SMD
Technology
Metal Oxide
Capacitance Value
105pF
Clamping Current
10A
Clamping Voltage
650V
Ac Voltage Rating (max)
250VAC
Dc Voltage Rating (max)
320VDC
Operating Temp Range
-40C to 85C
Mounting
Surface Mount
Surge Current (max)
1200A
Size Code
4032
Product Length (mm)
10.2mm
Product Depth (mm)
8mm
Product Height (mm)
4.5mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B72660M 251K 72
B72660M0251K072
B72660M251K72

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CU4032K250G2
Manufacturer:
TDK-EPCOS
Quantity:
20 000
Part Number:
CU4032K250G2
Manufacturer:
EPCOS/爱普科斯
Quantity:
20 000
Company:
Part Number:
CU4032K250G2
Quantity:
3 563
Company:
Part Number:
CU4032K250G2
Quantity:
3 638
Company:
Part Number:
CU4032K250G2
Quantity:
3 563
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
SMD disk varistors (CU varistors)
Standard series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 27 of 35
As mounted on substrate

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