C650-260-WH Bourns Inc., C650-260-WH Datasheet - Page 4

• Manufacturer Part Number: C650-260-WH
• Description: SURGE SUPP TBU 260MA 650VIMP SMD
• Manufacturer: Bourns Inc.
• Series: TBU™r

Specifications of C650-260-WH

• Voltage - Working: 300V
• Technology: Mixed Technology
• Number Of Circuits: 1
• Applications: General Purpose
• Package / Case: 0.325" L x 0.157 " W x 0.033" H (8.25mm x 4mm x 0.85mm)
• Voltage Rating: 14 V
• Current Rating: 260 mA
• Height: 0.85 mm
• Length: 8.25 mm
• Mounting: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Termination Style: SMD/SMT
• Width: 4 mm
• Suppressor Type: Data Line / Mains
• Output Current: 520mA
• Peak Surge Current: 260mA
• Response Time: 1µs
• Resistance: 8ohm
• Operating Temperature Max: 85°C
• Clamping Voltage Vc Max: 650V
• Length/height, External: 0.85mm
• Rohs Compliant: Yes
• External Depth: 4mm
• External Width: 8.25mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TBU
thickness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking
any power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not
allow any signal, ground or power signals beneath any of the pads of the device.
Profi le Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
Time maintained above:
Peak/Classifi cation Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Thermal Resistances
Product Dimensions
Recommended Pad Layout
Refl ow Profi le
Symbol
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
- Temperature (TL)
- Time (tL)
R
®
TBU
th(j-a)
(.140)
A
3.55
protectors have matte-tin termination fi nish. Suggested layout should use non-solder mask defi ne (NSMD). Recommended stencil
®
(.028)
(.103)
2.625
0.70
Parameter
Junction to leads (package)
C650 and C850 Protectors
PIN 1
TOP VIEW
B
(.045)
1.15
C
SIDE VIEW
D
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
J
3
Pad #
E
K
1
2
3
BOTTOM VIEW
Pad Designation
Value
116
K
2
F
1
E
J
Apply
In/Out
In/Out
Customers should verify actual device performance in their specifi c applications.
NC
°C/W
Unit
H
N
N
Dim.
Specifi cations are subject to change without notice.
A
B
C
D
E
H
K
N
F
J
DIMENSIONS:
(.154)
(.321)
(.031)
0.000
(.000)
(.100)
(.043)
(.136)
(.008)
(.026)
(.008)
Min.
8.15
0.80
1.10
3.45
0.20
0.65
0.20
3.90
2.55
0.025
(.157)
(.325)
(.033)
(.001)
(.102)
(.045)
(.138)
(.010)
(.028)
(.010)
(INCHES)
Typ.
4.00
2.60
1.15
3.50
0.25
0.70
0.25
8.25
0.85
MM
(.161)
(.329)
(.035)
0.050
(.002)
(.104)
(.047)
(.140)
(.012)
(.030)
(.012)
Max.
4.10
8.35
0.90
2.65
1.20
3.55
0.30
0.75
0.30