MCP1802T-5002I/OT Microchip Technology, MCP1802T-5002I/OT Datasheet - Page 18

• Manufacturer Part Number: MCP1802T-5002I/OT
• Description: IC REG LDO 300MA 5.0V SOT23-5
• Manufacturer: Microchip Technology

Specifications of MCP1802T-5002I/OT

• Package / Case: SOT-23-5, SC-74A, SOT-25
• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 10V
• Voltage - Dropout (typical): 0.2V @ 100mA
• Number Of Regulators: 1
• Current - Output: 300mA (Min)
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Outputs: 1
• Polarity: Positive
• Input Voltage Max: 10 V
• Output Voltage: 5 V
• Output Type: Fixed
• Dropout Voltage (max): 0.09 V at 30 mA
• Output Current: 300 mA
• Line Regulation: 0.2 % / V
• Load Regulation: 100 mV
• Voltage Regulation Accuracy: 2 %
• Maximum Power Dissipation: 0.25 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP1802T-5002I/OT; MCP1802T-5002I/OTTR

MCP1802
6.3
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
are calculated in the following example. The power
dissipation, as a result of ground current, is small
enough to be neglected.
6.3.1
Device Junction Temperature Rise
The internal junction temperature rise is a function of
internal power dissipation and the thermal resistance
from junction to ambient for the application. The
thermal resistance from junction to ambient (R
derived from an EIA/JEDEC standard for measuring
thermal resistance for small surface mount packages.
The EIA/JEDEC specification is JESD51-7, “High
Effective Thermal Conductivity Test Board for Leaded
Surface Mount Packages”. The standard describes the
test method and board specifications for measuring the
thermal resistance from junction to ambient. The actual
thermal resistance for a particular application can vary
depending on many factors, such as copper area and
thickness. Refer to AN792, “A Method to Determine
How Much Power a SOT23 Can Dissipate in an
Application”,
regarding this subject.
DS22053C-page 18
Package
Input Voltage
LDO Output Voltages and Currents
Maximum Ambient Temperature
Internal Power Dissipation
Internal Power dissipation is the product of the LDO
output current times the voltage across the LDO
(V
Package Type = SOT-23-5
IN
to V
T
P
T
T
J(RISE)
LDO(MAX)
JRISE
JRISE
T
Voltage Regulator
OUT
A(MAX)
V
P
P
POWER DISSIPATION EXAMPLE
I
OUT
OUT
LDO
LDO
V
).
= P
= 161.8 milli-Watts x 256.0
= 41.42
IN
(DS00792),
= 2.4V to 5.0V
= 1.8V
= 50 mA
= +40°C
= (V
= (5.0V - (0.98 x 1.8V)) x 50 mA
= 161.8 milli-Watts
TOTAL
IN(MAX)
°
C
x Rq
JA
- V
for
OUT(MIN)
more
) x I
°
C/Watt
information
OUT(MAX)
JA
) is
Junction Temperature Estimate
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated in the following table.
Maximum Package Power Dissipation at +25°C
Ambient Temperature
6.4
The MCP1802 can be used not only as a regulator, but
also as a low quiescent current voltage reference. In
many microcontroller applications, the initial accuracy
of the reference can be calibrated using production test
equipment or by using a ratio measurement. When the
initial accuracy is calibrated, the thermal stability and
line regulation tolerance are the only errors introduced
by the MCP1802 LDO. The low cost, low quiescent
current and small ceramic output capacitor are all
advantages when using the MCP1802 as a voltage
reference.
FIGURE 6-2:
Voltage Reference.
6.5
For some applications, there are pulsed load current
events that may exceed the specified 300 mA
maximum specification of the MCP1802. The internal
current limit of the MCP1802 will prevent high peak
load demands from causing non-recoverable damage.
The 300 mA rating is a maximum average continuous
rating. As long as the average current does not exceed
300 mA nor the max power dissipation of the packaged
device, pulsed higher load currents can be applied to
the MCP1802
MCP1802 is 380 mA (T
SOT-23-5 (256°C/Watt = R
25 µA Bias
C
1 µF
IN
P
P
D(MAX)
D(MAX)
Bridge Sensor
Voltage Reference
Pulsed Load Applications
T
T
MCP1802
V
GND
J
J
IN
= T
= 81.42°C
= (85°C - 25°C) / 256°C/W
= 234 milli-Watts
V
.
OUT
Ratio Metric Reference
The typical current limit for the
JRISE
C
1 µF
Using the MCP1802 as a
A
OUT
+ T
 2010 Microchip Technology Inc.
+25°C).
A(MAX)
JA
)
V
ADO
AD1
Microcontroller
REF
PIC
®