MCP1700T-3302E/TT Microchip Technology, MCP1700T-3302E/TT Datasheet - Page 18

IC LDO REG 200MA 3.3V SOT-23-3

MCP1700T-3302E/TT

Manufacturer Part Number
MCP1700T-3302E/TT
Description
IC LDO REG 200MA 3.3V SOT-23-3
Manufacturer
Microchip Technology
Type
Linearr
Datasheet

Specifications of MCP1700T-3302E/TT

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 6V
Voltage - Dropout (typical)
0.178V @ 250mA
Number Of Regulators
1
Current - Output
250mA (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Number Of Outputs
1
Polarity
Positive
Input Voltage Max
6 V
Output Voltage
3.3 V
Output Type
Fixed
Dropout Voltage (max)
350 mV
Output Current
250 mA
Line Regulation
0.75 % / V
Load Regulation
1 %
Voltage Regulation Accuracy
3 %
Maximum Power Dissipation
0.3696 W
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Package
3SOT-23
Function
LDO
Input Voltage Range
6 to 2.3 V
Maximum Output Current
0.25(Min) A
Accuracy
±2 %
Typical Dropout Voltage @ Current
0.178@250mA V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MCP1700T3302ETTTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP1700T-3302E/TT
Manufacturer:
MICROCHIP
Quantity:
45 000
Part Number:
MCP1700T-3302E/TT
Manufacturer:
Microchip Technology
Quantity:
46 386
Part Number:
MCP1700T-3302E/TT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
MCP1700T-3302E/TT
Quantity:
612
Part Number:
MCP1700T-3302E/TT
0
Company:
Part Number:
MCP1700T-3302E/TT
Quantity:
12 000
Part Number:
MCP1700T-3302E/TT CS9H
Manufacturer:
MICROCH1P
Quantity:
20 000
Part Number:
MCP1700T-3302E/TTVAO
0
MCP1700
DS21826B-page 18
3-Lead Plastic Transistor Outline (TO or ZB) [TO-92]
Notes:
1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
e
E
Number of Pins
Pitch
Bottom to Package Flat
Overall Width
Overall Length
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
N
R
b
A
L
c
1 2
3
Dimension Limits
Units
N
D
E
A
R
e
L
b
c
MIN
.125
.175
.170
.080
.500
.014
.014
.050 BSC
INCHES
Microchip Technology Drawing C04-101B
3
MAX
.165
.205
.210
.105
.021
.022
© 2007 Microchip Technology Inc.
D

Related parts for MCP1700T-3302E/TT