MCP1700T-2102E/TT Microchip Technology, MCP1700T-2102E/TT Datasheet
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MCP1700T-2102E/TT
Specifications of MCP1700T-2102E/TT
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MCP1700T-2102E/TT Summary of contents
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... BiPolar LDOs”, DS00766, Microchip Technology Inc., 2002 • AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application”, DS00792, Microchip Technology Inc., 2001 © 2007 Microchip Technology Inc. MCP1700 General Description The MCP1700 is a family of CMOS low dropout (LDO) voltage regulators that can deliver up to 250 mA of current while consuming only 1.6 µ ...
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... MCP1700 Functional Block Diagrams V IN Over Current Over Temperature Typical Application Circuits V OUT 1.8V I OUT 150 mA DS21826B-page 2 MCP1700 Error Amplifier +V IN Voltage - Reference + GND MCP1700 V GND IN (2.3V to 3.2V OUT C OUT 1 µF Ceramic V OUT µF Ceramic © 2007 Microchip Technology Inc. ...
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... Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. © 2007 Microchip Technology Inc. † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is ...
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... Exceeding the maximum allowable power = 100 µ LOAD Conditions °C °C °C Minimum Trace Width Single Layer °C/W Board °C/W Typical FR4 4-layer Application °C/W Typical, 1 square inch of copper EIA/JEDEC JESD51-751-7 °C/W 4-Layer Board ). Exceeding the maximum allowable power © 2007 Microchip Technology Inc. ...
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... R 2. 1.2V R 1.75 V 1.50 R 1.25 -40 -25 - Junction Temperature (°C) FIGURE 2-3: Quiescent Current vs. Junction Temperature. © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT 1.206 1.204 1.202 1.200 40°C J 1.198 1.196 1.194 1.192 1.190 5.0 5.5 6.0 2 FIGURE 2-4: ...
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... Load Current (mA) Output Voltage vs. Load = 2.8V +25° 40° 5. +125° 100 150 200 250 Load Current (mA) Output Voltage vs. Load = 5.0V +125° +25° 40° 100 125 150 175 200 225 250 Load Current (mA) Dropout Voltage vs. Load = 2.8V). © 2007 Microchip Technology Inc. ...
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... Load Current (mA) FIGURE 2-13: Dropout Voltage vs. Load Current (V = 5.0V). R FIGURE 2-14: Power Supply Ripple Rejection vs. Frequency (V = 1.2V). R FIGURE 2-15: Power Supply Ripple Rejection vs. Frequency (V = 2.8V). R © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT OUT 0.1 0.01 0.01 200 225 ...
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... R FIGURE 2-21: Dynamic Load Step . (V = 2.8V) R DS21826B-page 8 = 1.8V µF Ceramic (X7R), C OUT FIGURE 2-22 5.0V) R FIGURE 2-23 2.8V) R FIGURE 2-24 1.2V µF Ceramic (X7R 100 µ Dynamic Load Step . Dynamic Line Step . Startup From V IN © 2007 Microchip Technology Inc. ...
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... IN 0 -0.1 -0 2.2V IN -0.3 -0.4 -40 -25 - Junction Temperature (°C) FIGURE 2-27: Load Regulation vs. Junction Temperature (V = 1.8V). R © 2007 Microchip Technology Inc. = 1.8V µF Ceramic (X7R), C OUT 0 -0.1 -0.2 -0.3 -0.4 V -0.5 -0.6 -0.7 -40 -25 FIGURE 2-28: IN Junction Temperature (V 0.1 0. -0.05 V -0.1 -0 ...
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... OUT load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be electrolytic. The low ESR characteristics of the ceramic will yield better noise and PSRR performance at high frequency. Function ceramic, tantalum or aluminum © 2007 Microchip Technology Inc. ...
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... V IN Overcurrent Overtemperature FIGURE 4-1: Block Diagram. © 2007 Microchip Technology Inc. 4.3 Overtemperature The internal power dissipation within the LDO is a function of input-to-output voltage differential and load current. If the power dissipation within the LDO is excessive, the internal junction temperature will rise above the typical shutdown threshold of 140° ...
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... Output Rise time When powering up the internal reference output, the typical output rise time of 500 µs is controlled to prevent overshoot of the output voltage. ≥ 2.5V). For applications R © 2007 Microchip Technology Inc. ...
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... MCP1700, the total internal power dissipation is multiplied by the thermal resistance from junction to ambient (Rθ ). The thermal resistance from junction to JA ambient for the SOT-23 pin package is estimated at 230 C/W. ° © 2007 Microchip Technology Inc. EQUATION 6- MAX T = Maximum continuous junction J(MAX) temperature. ...
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... As long as the average current does not exceed 250 mA, pulsed higher load currents can be applied to the MCP1700 MCP1700 is 550 JRISE A(MAX Ratio Metric Reference ® PIC Microcontroller V OUT REF C OUT 1 µF ADO AD1 Using the MCP1700 The typical current limit for the +25°C). A © 2007 Microchip Technology Inc. ...
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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2007 Microchip Technology Inc. MCP1700 Standard Extended Temp Symbol ...
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... E 2.10 E1 1.16 D 2.67 L 0.13 φ 0° c 0.08 b 0.30 φ L NOM MAX 3 – 1.12 0.95 1.02 – 0.10 – 2.64 1.30 1.40 2.90 3.05 0.50 0.60 – 10° – 0.20 – 0.54 Microchip Technology Drawing C04-104B © 2007 Microchip Technology Inc. ...
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... Leads 1 & 3 Width Notes: 1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc ...
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... BSC: Basic Dimension. Theoretically exact value shown without tolerances. DS21826B-page Units INCHES Dimension Limits MIN .050 BSC D .125 E .175 A .170 R .080 L .500 c .014 b .014 Microchip Technology Drawing C04-101B D MAX .165 .205 .210 .105 – .021 .022 © 2007 Microchip Technology Inc. ...
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... Updated Packaging Information. • Corrected Section “Product Identification System”. • Changed X5R to X7R in Notes to “DC Characteristics”, “Temperature Specifications”, and “Typical Performance Curves” . Revision A (November 2005) • Original Release of this Document. © 2007 Microchip Technology Inc. MCP1700 DS21826B-page 19 ...
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... MCP1700 NOTES: DS21826B-page 20 © 2007 Microchip Technology Inc. ...
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... TO = Plastic Small Outline Transistor (TO-92), 3-lead TT = Plastic Small Outline Transistor SOT-23), 3-lead © 2007 Microchip Technology Inc. X /XX Examples: SOT-89 Package: Temp. Package Range a) MCP1700T-1202E/MB: 1. MCP1700T-1802E/MB: 1. MCP1700T-2502E/MB: 2. MCP1700T-3002E/MB: 3. MCP1700T-3302E/MB: 3. MCP1700T-5002E/MB: 5.0V V TO-92 Package: g) MCP1700-1202E/TO: h) MCP1700-1802E/TO: i) MCP1700-2502E/TO: j) MCP1700-3002E/TO: k) MCP1700-3302E/TO: l) MCP1700-5002E/TO: SOT-23 Package: a) MCP1700T-1202E/TT: b) ...
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... MCP1700 NOTES: DS21826B-page 22 © 2007 Microchip Technology Inc. ...
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... Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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