MCP6V01-E/SN Microchip Technology, MCP6V01-E/SN Datasheet - Page 28

• Manufacturer Part Number: MCP6V01-E/SN
• Description: IC OPAMP AUTO-ZERO SNGL 8SOIC
• Manufacturer: Microchip Technology

Specifications of MCP6V01-E/SN

• Slew Rate: 0.5 V/µs
• Package / Case: 8-SOIC (3.9mm Width)
• Amplifier Type: Chopper (Zero-Drift)
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 1.3MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 2µV
• Current - Supply: 300µA
• Current - Output / Channel: 22mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 1
• Common Mode Rejection Ratio (min): 130 dB
• Input Offset Voltage: 0.002 mV
• Input Bias Current (max): 1 pA
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Technology: CMOS
• Voltage Gain Db: 156 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP6V01DM-VOS - DEMO BOARD FOR MCP6V01MCP6V01RD-TCPL - REF DESIGN THERMCPL FOR MCP6V01
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP6V01/2/3
4.3.9.5
In cases where an individual resistor needs to have its
thermo-junction voltage cancelled, it can be split into
two equal resistors as shown in
the thermal gradients near the resistors as small as
possible, the layouts are symmetrical with a ring of
metal around the outside. Make R
R
FIGURE 4-14:
Resistors.
Minimize temperature gradients at critical components
(resistors, op amps, heat sources, etc.):
• Minimize exposure to gradients
• Align with constant temperature (contour) lines
• Minimize magnitude of gradients
Make the temperature gradient point in one direction:
• Add guard traces
• Shape any FR4 gaps
DS22058C-page 28
2A
Note:
- Small components
- Tight spacing
- Shield from air currents
- Place on PCB center line
- Select parts with lower power dissipation
- Use same metal junctions on thermo-junc-
- Use metal junctions with low temperature to
- Large distance from heat sources
- Ground plane underneath (large area)
- FR4 gaps (no copper for thermal insulation)
- Series resistors inserted into traces (adds
- Use heat sinks
- Constant temperature curves follow the
- Connect to ground plane
- Constant temperature curves follow the
= R
tions that need to match
voltage coefficients
thermal and electrical resistance)
traces
edges
R
2B
1A
R
= 2R
1A
Changing the orientation of the resistors
will usually cause a significant decrease in
the cancellation of the thermal voltages.
Other PCB Thermal Design Tips
R
2
.
1B
R
1B
PCB Layout for Individual
Figure
1A
R
R
= R
2A
2B
R
R
2A
2B
4-14. To keep
1B
= R
1
/2 and
4.3.9.6
DC crosstalk causes offsets that appear as a larger
input offset voltage. Common causes include:
• Common mode noise (remote sensors)
• Ground loops (current return paths)
• Power supply coupling
Interference from the mains (usually 50 Hz or 60 Hz),
and other AC sources, can also affect the DC perfor-
mance. Non-linear distortion can convert these signals
to multiple tones, included a DC shift in voltage. When
the signal is sampled by an ADC, these AC signals can
also be aliased to DC, causing an apparent shift in
offset.
To reduce interference:
4.3.9.7
Keep the resistances seen by the input pins as small
and as near to equal as possible to minimize bias cur-
rent related offsets.
Make the (trace) capacitances seen by the input pins
small and equal. This is helpful in minimizing switching
glitch-induced offset voltages.
Bending a coax cable with a radius that is too small
causes a small voltage drop to appear on the center or
(the tribo-electric effect). Make sure the bending radius
is large enough to keep the conductors and insulation
in full contact.
Mechanical stresses can make some capacitor types
(such as ceramic) to output small voltages. Use more
appropriate capacitor types in the signal path and
minimize mechanical stresses and vibration.
Humidity can cause electro-chemical potential voltages
to appear in a circuit. Proper PCB cleaning helps, as
does the use of encapsulants.
- Keep traces and wires as short as possible
- Use shielding (e.g., encapsulant)
- Use ground plane (at least a star ground)
- Place the input signal source near to the DUT
- Use good PCB layout techniques
- Use a separate power supply filter (bypass
capacitors) for these auto-zeroed op amps
Crosstalk
Miscellaneous Effects
© 2008 Microchip Technology Inc.