MCP6282-E/SN Microchip Technology, MCP6282-E/SN Datasheet - Page 29

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MCP6282-E/SN

Manufacturer Part Number
MCP6282-E/SN
Description
IC OPAMP 2.2V DUAL R-R 8SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP6282-E/SN

Slew Rate
2.5 V/µs
Package / Case
8-SOIC (3.9mm Width)
Amplifier Type
General Purpose
Number Of Circuits
2
Output Type
Rail-to-Rail
Gain Bandwidth Product
5MHz
Current - Input Bias
1pA
Voltage - Input Offset
3000µV
Current - Supply
450µA
Current - Output / Channel
25mA
Voltage - Supply, Single/dual (±)
2.2 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Number Of Channels
2
Common Mode Rejection Ratio (min)
70 dB
Input Offset Voltage
3 mV
Input Bias Current (max)
1 pA
Operating Supply Voltage
3 V, 5 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Shutdown
No
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.2 V
Technology
CMOS
Voltage Gain Db
110 dB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP6282-E/SN
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
MCP6282-E/SN
Manufacturer:
AD
Quantity:
109
Part Number:
MCP6282-E/SN
Manufacturer:
MICROCHIP/微芯
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14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
© 2008 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
A2
E
Units
c
A2
A1
E1
L1
N
D
A
E
e
L
c
b
MCP6281/1R/2/3/4/5
L1
MIN
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
Microchip Technology Drawing C04-087B
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
DS21811E-page 29
L

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