LM358M/NOPB National Semiconductor, LM358M/NOPB Datasheet - Page 24

• Manufacturer Part Number: LM358M/NOPB
• Description: IC OP AMP DUAL LO/PWR 8-SOIC SMD
• Manufacturer: National Semiconductor

Specifications of LM358M/NOPB

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Slew Rate: 0.1 V/µs
• Gain Bandwidth Product: 1MHz
• Current - Input Bias: 45nA
• Voltage - Input Offset: 2000µV
• Current - Supply: 1mA
• Current - Output / Channel: 40mA
• Voltage - Supply, Single/dual (±): 3 V ~ 32 V, ±1.5 V ~ 16 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Bandwidth: 1 MHz
• Channel Separation: -120
• Common Mode Rejection Ratio: 85
• Current, Input Bias: 45 nA
• Current, Input Offset: 5 nA
• Current, Output: 40 mA
• Current, Supply: 0.5 mA
• Impedance, Thermal: 189 °C/W
• Number Of Amplifiers: Dual
• Package Type: SO-8
• Power Dissipation: 530 mW
• Temperature, Operating, Range: 0 to +70 °C
• Voltage, Gain: 100 V/mV
• Voltage, Input: -0.3 to +32 V
• Voltage, Offset: 2 mV
• Voltage, Output, High: 28 V
• Voltage, Output, Low: 5 mV
• Voltage, Supply: 5 V
• Dc: 11+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device
• Other names: *LM358M; *LM358M/NOPB; LM358MNS

Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X
IS PACKAGE WIDTH, X
IS PACKAGE LENGTH AND X
IS
1
2
3
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD
NS Package Number BPA08AAB
X
= 1.285 X
= 1.285
X
= 0.850
1
2
3
www.national.com
24