TS27M4IN STMicroelectronics, TS27M4IN Datasheet - Page 9

• Manufacturer Part Number: TS27M4IN
• Description: IC AMP PREC LP QUAD OP 14 DIP
• Manufacturer: STMicroelectronics

Specifications of TS27M4IN

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Slew Rate: 0.6 V/µs
• Gain Bandwidth Product: 1MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 1100µV
• Current - Supply: 150µA
• Current - Output / Channel: 45mA
• Voltage - Supply, Single/dual (±): 3 V ~ 16 V, ±1.5 V ~ 8 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Number Of Channels: 4
• Voltage Gain Db: 93.98 dB
• Common Mode Rejection Ratio (min): 65 dB
• Input Offset Voltage: 10 mV
• Operating Supply Voltage: 5 V, 9 V, 12 V, 15 V
• Supply Current: 0.8 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Request inventory verification / Request inventory verification
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-2263-5

TS27M4C, TS27M4I, TS27M4M
4
4.1
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
DIP14 package information
Figure 15. DIP14 package mechanical drawing
Table 4.
Ref.
a1
b1
e3
B
D
E
b
e
F
L
Z
I
®
packages. These packages have a lead-free second level interconnect. The
DIP14 package mechanical data
Min.
0.51
1.39
1.27
Millimeters
15.24
Typ.
0.25
2.54
0.5
8.5
3.3
Max.
1.65
2.54
7.1
5.1
20
0.020
0.055
0.050
Min.
Inches
Package information
0.020
0.010
0.335
0.100
0.600
0.130
Typ.
0.065
0.787
0.280
0.201
0.100
Max.
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